Some of you may be interested in the following: 1) Starting at the top, the top cover on the TI 6203 DSP/CSP's is aluminum going to copper plated with something then evolving soon into a glob top 2) The top currently used is only attached to the die - not to the BGA substrate. Interesting MSD issues as class 4 sensitive devices and all that entails. Also, the lid could not impose stresses on the BGA substrate causing excessive warp issues. 3) The flip chip is attached, via "normal" industry bonding and underfill techniques. 4) The BGA substrate is BT and is 6 layers going to two. Don't know how they're going to accomplish this feat. 5) Our "X" version parts had BGA balls falling off the substrate first because of a "bad supplier/process" or some such thing. Others fell off because of our "bad supplier/process" wherein an adequate thermal profile could not be achieved. The oven was a Heller 1700 though I belive it capable, the supplier could not get the recipe and cold solder joints were effected also causing balls to detach from both substrates. 6) I'll keep you posted as we build new boards and run the reliability testing. MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------