It would seem plausible to think that a "route before lamination" procedure could be used on the layers that occupy the space from .062 to .125 in the stack.  Maybe there are valid manufacturing issues that would preclude that from being an option.  Any PCB fabbers care to comment?

It appears to be similar to some of the issues involved in rigid/flex construction

Donn

Donn Smith, CID
Senior PCB Designer
GARMIN International
1200 E. 151st Street
Olathe, KS  66062-3426
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-----Original Message-----
From: Susy Webb [mailto:[log in to unmask]]
Sent: Wednesday, February 06, 2002 11:58 AM
To: [log in to unmask]
Subject: [DC] routing the thickness of a board


I've got a good one for the gurus out there!

And engineer just asked me if a rigid board could have an area (an edge
actually) routed such that the overall area of the board is one thickness
(.125), and the routed area is another (.062) See the side view picture
below...


routed area
          \   __________________
        _____|                  |
.062    |_______________________| .125



Other than the obvious issues of controlling routing depth, and I imagine a
hugh cost, what else should I be concerned about? Can it even be done??? We
were thinking that it might be easier to build two boards and fuse them into
one, but would the alignment problems kill that idea?

TIA for any help,
Susy

Susy Webb, CID
Sr PCB Designer
Carlo Gavazzi Computer Systens
281-875-1500 x33
[log in to unmask]

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