Oh uh, yes, me out of cave. Very bright out here. Smells better too. Werner, now we're getting somewhere. You are my consultant and I owe you big time. Check coming by big bird with no feathers. I still need to know if the die attach is via soldering process and bumps on flip side while using underfill - and lots of it too. Must be that. This sure doesn't look good to me as a simple knife wielding FA guy. Now I have to get that damn chip of that little board without loosing a finger. Also need a dremmel to do x-section. Hell, I could send it to Robisan. Susan, you ready for this and how about my photomicrographs? MoonCaveMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------