Thanks Dan and others for the input and it seems mostly positive. Still, I question the part first because it is based on the LCCC style. I haven't tried dissecting a part yet to determine what sits atop the PCB and how the internal device/chip is attached to it - die attache and wire bond I suppose. My biggest concerns are the gold and bow and twist of the part and the PCB to which it is attached. We have another out of control board situation, I just got into yesterday, and its warpage problem I am now solving (completely unbalanced MLB construction - what else but an unqualified supplier). The gold bothers me because I do not know its thickness and whether it is electroplated. With regards to gold, if electroplated, are you or anyone else solder dipping to remove it before attempting assembly. Just don't want embrittlement some where down the line. Thanks again, MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site http://www.ipc.org/html/forum.htm for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------