Hi all,
I've found this thread to be very interesting and
informative, but would like to present a "different twist" to the
subject:
I have a client using our Reballing system to
recondition all sorts of BGA and uBGA for re-use after de-soldering. They are
currently using a water soluble paste and cleaning with DI, however the residual
absorbed moisture presents a concern, so the devices are baked after cleaning.
This increases turnaround time, so they are considering moving to a no-clean
process.
My opinion is that there will be residues and
they could possibly be incompatible with subsequent platforms utilized by the
end user, as well as creating aesthetic impact. Cleaning alternatives for
no-clean fluxes rival the more aggressive (therefore more forgiving) water
solubles, so the benefit is lost if cleaned.
Any and all opinions, theories, suggestions and
experiences are welcomed!
Regards,
Ed Popielarski
QTA Machine
10 Mc Laren, Ste
D
Irvine, Ca. 92618
Phone:949-581-6601
Fax: 949-581-2448
Cel:
949-337-2578