Kirk: It has been some time since performing this test, but if memory serves tin is measured chemically by ASTM E46; impurities (including copper, gold, cadmium, zinc, aluminum, antimony, iron, arsenic, bismuth, silver, and nickel), are measured spectrometrically (AA) by ASTM E663; and lead is reported as the "balance". I am unsure of the ASTM designation for ICP determination, but the general digestion method described in E663 may be the same for ICP. If silver is being determined, keep in mind aqua regia (HCl/HNO(3)) cannot be employed as to dissolve the sample. As previously mentioned, your current solder supplier should perform this test for you AND provide you a copy of the method employed. Regards, Ted Stern Kirk Kosel wrote: > Thanks for the responses. One more question, any idea on how to get > the solder (and impurities) in solution for ICP analysis? Thanks again > for your help, Kirk --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------