Is it OK to have flux residue on assemblies when the process is no clean. *That depends entirely on what flux you are using, the amount of flux your are applying, and the reflow profile you are using. I suggest you get a copy of IPC-TP-1115, that goes over the things you need to think about when transitioning to no-clean assembly. Flux is one of the considerations. We have assemblies that are failing in the field and the customer thinks this flux residue may be an issue. They think the assembly has been wet. *What is the failure mechanism? How many assemblies are affected? What does your customer mean by "wet"? What do you think???? *I think we need more information. Doug Pauls Rockwell Collins --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------