Ouch! All them pressures and leverages and stresses and .... what the hell kind of chassis does that assemblage fit? Who's the thermal engineer on this one? - 'coz I don't think much of his thermal pads between chips and G-clamp. Intel have got the jump on this fellow with their P4 solution, though it's about as chunky. What can one say, seriously? Hope it doesn't crop up in anything I buy. Peter SteveZeva@AOL .COM To: [log in to unmask] Sent by: cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST TechNet Aero/ST Group) <[log in to unmask] Subject: [TN] Creative Engineering and ORG> Manufacturing Methods.. 01/26/02 03:08 AM Please respond to "TechNet E-Mail Forum."; Please respond to SteveZeva Hi all! Earl sent me a photo showing a fine example of Creative Engineering and Manufacturing methods, and invites any comments B^} -Steve Gregory- [This e-mail is confidential and may also be privileged. If you are not the intended recipient, please delete it and notify us immediately; you should not copy or use it for any purpose, nor disclose its contents to any other person. Thank you.] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------