I vote for mole hill becoming mountain with cave in it for MoonMan (Werner now calls me MoonCaveMan). I think this outlaw bit has done got outa hand. Sure a lot of newer (to me) respondants with some good opinions. Mine probably is not so good but never cared one way or another about these pads. Mostly eliminated them using CAD or CAM. I do like that plating "anchor" thing (just seems cool but for what) though I've never seen failures without them (what's to fail), except when processes mis-managed, using test coupon x-sectional analysis, as received or after thermal stress, or when destroying perfectly good boards, or not. As fars as pads moving, they sure do during relamination and a lot too. However, so does everything else on the inners. I'm still a pad only outer and non-functional inner pad removal guy. Just call me old fashioned or - MoonCaveMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------