Though I kinda like the look of the solder joints, I do believe they may be a little light on the solder paste volume having been printed using a 5 mil thick stencil. The thickness is fine for .8 mm stuff and xfine pitch QFP's. However, I have used step down foils, from 6.5 mils to 5 mils, to ensure specified paste volume for all parts to accomodate the 1206 types as well. Also, as previously discussed, I reduce BGA pad sizes 20% from device ball sizes. For my current design, with a 5 mil thick stencil, I'm printing one to one with the pad size. Can I hear an Ahmen from all you SMT brethren out there or am I in purgatory about to face eternal damnation? MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------