Guy, The cave is quite resplendent with most ameneties. HASL is not one of them. Werner once responded, accurately, any process can be mis-managed as in the HASL thing. One thing that cannot be managed is the copper surface of a board about to enter HASL hell. The copper surface is cleaned, micro-etched, rinsed, dried (wherein the biggest process mis-management occurs), then introduced to fluxes often incapable of removing the oxidation imparted by the drying process. This is my big gripe against HASL now that I've grown so fond of very "thick" IMC's. Amazingly, I have seen HASL surfaces very flat, shiney, bright, and solderable. I don't remember where I saw this phenomonom. Probably in my dreams but it was a wonder. I also wonder, if it was not a dream, where these conditions were produced. Any board fab folks out there? As for popping my head out of the cave, it gets very lonely in here, or not, and fresh air always is appreciated. However, I'm not a weather reporter based on shadow. What's with this strange passage. No snow covering my cave opening. MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL To recieve ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------