At 01:37 PM 12/7/01 -0600, you wrote: >Date: Fri, 7 Dec 2001 13:37:39 -0600 >Reply-To: TechNet <[log in to unmask]> >Sender: TechNet <[log in to unmask]> >From: Automatic digest processor <[log in to unmask]> >Subject: TechNet Digest - 7 Dec 2001 - Special issue (#2001-764) >To: Recipients of TechNet digests <[log in to unmask]> > >There are 12 messages totalling 921 lines in this issue. > >Topics in this special issue: > > 1. Info on lead free reflow profiles sought (3) > 2. Alkaline Etchant--response > 3. Via repairs (2) > 4. SURFACE FINISHES (2) > 5. 2 Conformal Coating ?'s (2) > 6. BGA Visual Inspection (2) > >--------------------------------------------------------------------------- >------ >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send the following message: SET >Technet NOMAIL >Search previous postings at: www.ipc.org > On-Line Resources & Databases > >E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >--------------------------------------------------------------------------- >------ >Date: Fri, 7 Dec 2001 12:31:26 -0500 >From: "Tempea, Ioan" <[log in to unmask]> >Subject: Re: Info on lead free reflow profiles sought >MIME-Version: 1.0 >Content-Type: text/plain > >Hi Eric, > >check >http://www.vitronics-soltec.com/Vis/Vis_r5.nsf/technology!OpenFrameSet, then >processes/reflow. the link that pops-up an article is "lead-free reflow >soldering ". > >Besides that, a couple of days ago I got mail from Vitronics, having inside >a CD called "5 steps to lead-free". The problem is I don't know why I got >it, was it me ordering it, probably through their website, or simply, a >courtesy from Vitronics? Mistery! > >I think you could also contact Vitronics for this CD. > >Regards, >Ioan > > > -----Original Message----- > > From: Eric Christison [SMTP:[log in to unmask]] > > Sent: Friday, December 07, 2001 11:36 AM > > To: [log in to unmask] > > Subject: [TN] Info on lead free reflow profiles sought > > > > After half an hour's fruitless searching of the net I thought of Technet. > > > > Can anyone out there point me at a web page or email me a reflow profile > > for one of the higher > > melting point lead free solders. I'm trying to produce a test spec to > > determine whether some > > temperature sensitive components would survive a 'worst case' reflow > > cycle. > > > > By the way. I note that many of the lead free alloys contain Bismuth. > > Isn't this more toxic > > than lead? Am I being naive in my surprise that one toxic chemical is > > being replaced with > > something equally bad? > > > > Regards, > > > > -------------------------------------------------------------------------- > > ------- > > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > > To unsubscribe, send a message to [log in to unmask] with following text in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt delivery of Technet send the following message: SET > > Technet NOMAIL > > Search previous postings at: www.ipc.org > On-Line Resources & Databases > > > E-mail Archives > > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > > additional > > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > > ext.5315 > > -------------------------------------------------------------------------- > > ------- >Date: Fri, 7 Dec 2001 12:36:12 -0500 >From: Bev Christian <[log in to unmask]> >Subject: Re: Info on lead free reflow profiles sought >MIME-Version: 1.0 >Content-Type: text/plain; charset="iso-8859-1" > >Eric, >I am still hunting for good net sites for your first request. > >With regards to the latter: >No, bismuth is not more toxic. Bismuth oxychloride is used in the cosmetics >industry and other bismuth salts (I forget which one(s)) are used in >PeptoBismol® (Did I spell that right?) No bismuth compounds are listed in >the 1990 "NIOSH Pocket Guide to Chemical Hazards" I have and only bismuth >telluride is listed in the ACGIH TLV Booklet - because of the tellurium. >Toxicity does come into play in its mining, though, as 10 to 40% (depends on >who you talk to and/or whether you are talking world-wide or country >specific) comes as a by-product of lead mining. > >regards, >Bev Christian >Research in Motion > >-----Original Message----- >From: Eric Christison [mailto:[log in to unmask]] >Sent: December 7, 2001 11:36 AM >To: [log in to unmask] >Subject: [TN] Info on lead free reflow profiles sought > > >After half an hour's fruitless searching of the net I thought of Technet. > >Can anyone out there point me at a web page or email me a reflow profile for >one of the higher >melting point lead free solders. I'm trying to produce a test spec to >determine whether some >temperature sensitive components would survive a 'worst case' reflow cycle. > >By the way. I note that many of the lead free alloys contain Bismuth. Isn't >this more toxic >than lead? Am I being naive in my surprise that one toxic chemical is being >replaced with >something equally bad? > >Regards, > >---------------------------------------------------------------------------- >----- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send the following message: SET >Technet NOMAIL >Search previous postings at: www.ipc.org > On-Line Resources & Databases > >E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >---------------------------------------------------------------------------- >----- >Date: Fri, 7 Dec 2001 09:40:07 -0800 >From: Richard Hamilton <[log in to unmask]> >Subject: Re: Info on lead free reflow profiles sought >MIME-Version: 1.0 >Content-Type: text/plain; charset="us-ascii"; format=flowed > >Eric, > >I hate to assume anything, so.....in case you are not aware there is a >LeadFreeNet also with IPC, you may want to post this there also. > >Richard > >At 04:35 PM 12/7/01 +0000, you wrote: >>After half an hour's fruitless searching of the net I thought of Technet. >> >>Can anyone out there point me at a web page or email me a reflow profile >>for one of the higher >>melting point lead free solders. I'm trying to produce a test spec to >>determine whether some >>temperature sensitive components would survive a 'worst case' reflow cycle. >> >>By the way. I note that many of the lead free alloys contain Bismuth. >>Isn't this more toxic >>than lead? Am I being naive in my surprise that one toxic chemical is >>being replaced with >>something equally bad? >> >>Regards, > > >Date: Fri, 7 Dec 2001 12:52:54 EST >From: Dennis Fritz <[log in to unmask]> >Subject: Re: Alkaline Etchant--response >MIME-Version: 1.0 >Content-Type: text/plain; charset="US-ASCII" >Content-Transfer-Encoding: 7bit > >The following are some tips on running alkaline etchant, especially where >production volume has decreased. > >1. Alkaline etchants are formulated with ammonia and chloride contents >appropriate for percentage operating time. You may have now "hitched a race >horse to an ox cart" so to speak. You may want to contact your vendor to >change to a product more suited to your present operation, just as when your >volume went up, you traded your ox for the race horse. > >Why is that? Race horse etchants are formulated for say 75% operation time >and frequent sump turnover, - with high chloride (copper capacity) and lower >excess ammonia (little idle time for ammonia evaporation). > >2. As much as possible, group your etching work into "bursts" of activity. >Close down the dampers and shut off the sump heat when the etcher is not in >use. > >3. Decrease the sump volume as much as possible with glass bricks, or similar >inert media. This will allow more sump turnovers of the spent etchant per >week. Calculate the turnover time for your sump - If it is longer than a >couple of days - you are going to be fighting add-backs of anhydrous ammonia, >or walking a tightrope with aqua ammonia add-backs. > >Rudy misses one point in specificaions on incoming alkaline etchant. >Essentially all alkaline etchant uses recycle ammonia, and rest assured the >copper in spent etchant is reclaimed. This ammonia recycle step means the >spec is wider than for formulated products, but when you need to brag about >recycle in your shop, point out that BOTH the copper and the ammonia in your >spent alkaline etch get recycled. > >Denny Fritz >MacDermid, Inc. >Date: Fri, 7 Dec 2001 09:48:23 -0800 >From: James Miller <[log in to unmask]> >Subject: Via repairs >MIME-Version: 1.0 >Content-Type: text/plain; format=flowed > >I am trying to do some repairs on vias of an assembled board that were >damaged due to test technicians scraping soldermask for ICT. The vias show >signs of thinning/cracking at the knee. IPC 7721 shows that using eyelets >are the acceptable repair for plated thru holes but they do not address vias >anywhere that I am aware of. I can't imagine putting eyelets into a via. > >I am considering putting a solid wire into the via and filling it with >solder to make the connection from top to bottom. Is this acceptable? If >not then what is an acceptable method of repair? Any input would be >appreciated. > >Sincerely >Jim > > >_________________________________________________________________ >Get your FREE download of MSN Explorer at http://explorer.msn.com/intl.asp > > >Date: Fri, 7 Dec 2001 12:05:30 -0600 >From: David Hillman <[log in to unmask]> >Subject: Re: SURFACE FINISHES >MIME-Version: 1.0 >Content-Type: text/plain; charset="us-ascii" > >Hi Charlie! I hadn't seen an assembler's response so I'll deposit mine for >TechNet dissection. We have qualified immersion gold, immersion tin, and >immersion silver as alternative pwb surface finishes for our manufacturing >processes as HASL replacements. I don't foresee any one of the three >alternatives as becoming "dominate" because each has both pro's and con's: > >Immersion gold: wonderfully flat, good long term solderability, good >industry availability, BUT black pad issues, its a nasty chemistry on >soldermask, and soldering to nickel is not soldering to copper > >Immersion tin: wonderfully flat, metallurgical compatibility, reworkable, >BUT long term solderability issues, compatibility with soldermasks, and >supply sources > >Immersion silver: wonderfully flat, reworkable, great RF design >characteristics, BUT supply source issues, metallurgical questions, and >long term solderability questions > >I think that the selection of an alternative surface finishes will become a >question of materials organization within a particular manufacturing >environment - HASL made our choices simpler but was definitely robustness >limiting for certain manufacturing flows (like SMT fine pitch). > >Dave Hillman >Rockwell Collins >[log in to unmask] > > > > > >Charles McMahon <[log in to unmask]>@ipc.org> on 12/05/2001 11:33:26 AM > >Please respond to "TechNet E-Mail Forum." <[log in to unmask]> > >Sent by: TechNet <[log in to unmask]> > > >To: [log in to unmask] >cc: > >Subject: Re: [TN] SURFACE FINISHES > > >EARL: > >Does your view hold the same from an assemblers point of view. > >More specifically, in your history, would the assembler prefer ENIG over >SILVER and/or TIN? >THe assemblers I speak with just do not have the background/experience to >decide. However, they >are quick to reject the bare board vendor for what they THINK is a >solderability problem. >(That's when I move with failure review etc. I hope to reduce this >incidence >dramatically by proposing user friendly finishes based on board design.) > >Charlie > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]]On Behalf Of Earl Moon >Sent: Wednesday, December 05, 2001 12:14 PM >To: [log in to unmask] >Subject: Re: [TN] SURFACE FINISHES > > >As a cost factor to you it's nickle and dime stuff. To most board shops I >work with, it is as well. It's a matter of choice so much that it's almost >subjective (whatever looks best though black pad isn't too pretty) - >excluding HASL, or course. I hope you are right about its final demise. > >MoonMann > >---------------------------------------------------------------------------- > >----- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send the following message: SET >Technet NOMAIL >Search previous postings at: www.ipc.org > On-Line Resources & Databases > >E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for >additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >---------------------------------------------------------------------------- > >----- > >--------------------------------------------------------------------------- >------ > >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send the following message: SET >Technet NOMAIL >Search previous postings at: www.ipc.org > On-Line Resources & Databases > >E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for >additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >--------------------------------------------------------------------------- >------ >Date: Fri, 7 Dec 2001 12:08:00 -0600 >From: Kathy Kuhlow <[log in to unmask]> >Subject: Re: Via repairs >MIME-Version: 1.0 >Content-Type: multipart/mixed; boundary="=_CC91EC8C.73127F25" > >I have used solid wire for a long time and have had no issues with this >method. I do suggest though to leave a small amount of a tail to lay over >the pad on each side. I feel that this allows the vertical fill and also >gives the joint a little more integrity with the lead soldered onto the >pad also. > >Kathy > >Date: Fri, 7 Dec 2001 17:51:07 -0000 >From: Peter Swanson <[log in to unmask]> >Subject: Re: 2 Conformal Coating ?'s >MIME-Version: 1.0 >Content-Type: text/plain; charset="iso-8859-1" > >Graham, > >You really must see someone about your delusions over UV cured coatings, >which are successfully used to coat many thousands of pcb's each year. I >know someone who has a nice sofa you can stretch out on whilst you tell him >all about it.... <g> > >Suitability for UV has nothing to do with 3D v. 2D, more to do with the >complexity of the assembly geometry and the application methodology. These >will determine if a secondary cure mechanism is needed for the application. >In many instances (and with some of our customers), full cure is achieved >just with light. > >Regards, >Peter >-- >-------------------------------------------------------- >Peter Swanson [log in to unmask] >INTERTRONICS http://www.intertronics.co.uk > > INTERTRONICS is dedicated to providing quality > material, consumable and equipment solutions to the > electronics manufacturing and other technology based > industries, with the highest levels of technical > support and customer service. > > >-----Original Message----- >From: Graham Naisbitt [mailto:[log in to unmask]] >Sent: 06 December 2001 16:52 >To: [log in to unmask] >Subject: Re: [TN] 2 Conformal Coating ?'s > > >Mike > >You would be better to go with a conventional coating. UV is not ideal for >3D objects - works great in 2D, cos you don't have to bend light! :-) > >I cannot remember what the operating environment was for your circuit - if >you would care to repeat, I can recommend something - however, I am sure >that a one part AR or UR coating from a reliable supplier will give you the >best overall results - process and operating environment. > >Regards, Graham Naisbitt > >[log in to unmask] >www.concoat.co.uk <http://www.concoat.co.uk> > >For instant access to Product Data Sheets register on the Tech-Shot area of >http:// www.concoat.co.uk <http://www.concoat.co.uk> > >Concoat Limited >Alasan House, Albany Park >CAMBERLEY GU16 7PH UK >Phone: +44 (0)1276 691100 >Fax: +44 (0)1276 691227 >Mobile: +44 (0)79 6858 2121 > > > > > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]]On Behalf Of Mike Manwell >Sent: Thursday, December 06, 2001 02:41 >To: [log in to unmask] >Subject: [TN] 2 Conformal Coating ?'s > > >Hello, >Thanks in advance if you have taken the time to read this! > >#1- Im trying different materials in a spray application. Both are cured >using UV. One material does a "secondary cure" w/ moisture. This is cool >because after 100 hours after UV cure, all material is fully cured. >The other material Im trying uses HEAT for a secondary cure, or, if >shodowed during UV cure, the material wont cure and never will. Obviously I >dont want the stuff dripping or running anywhere, but being new to this >wonderful process, just dont feel good about leaving uncured material on a >product for it's entire life. Iv been told that you can "test" the product >to see if the uncured material is causing a problem but Im not sure what >type of test that would consist of. Any insight? > >#2- Has anyone out there ever installed refelctive metal plates in their UV >oven to limit shadowing? > >Thanks so much, > >Mike Manwell > >---------------------------------------------------------------------------- >----- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send the following message: SET >Technet NOMAIL >Search previous postings at: www.ipc.org > On-Line Resources & Databases > >E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >---------------------------------------------------------------------------- >----- > >---------------------------------------------------------------------------- >----- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send the following message: SET >Technet NOMAIL >Search previous postings at: www.ipc.org > On-Line Resources & Databases > >E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >---------------------------------------------------------------------------- >----- >Date: Fri, 7 Dec 2001 17:51:15 -0000 >From: Peter Swanson <[log in to unmask]> >Subject: Re: 2 Conformal Coating ?'s >MIME-Version: 1.0 >Content-Type: text/plain; charset="iso-8859-1" > >Mike, > >Question 1: Whatever cure mechanism you use, be sure not to leave any >uncured material around, as it is likely to cause trouble in the future, >whether it me just messy, or something else. For example, the electrical >characteristics of the uncured coating are likely to be very different than >the cured one. > >One point about moisture cure is, of course, that it is moisture dependent, >and as Jon More stated, not in your control - can vary in cure time from >very short to, sometimes, not at all! > >Question 2: A good idea if your pcb geometry needs it. Years ago, I saw a >curing machine where the lamp was swung back and forth in an arc over the >conveyor whilst the assembly moved through, to help in this area. Lamps can >also be added on the sides of conveyors, giving extra light perpendicular to >the overhead lamp. > >If you can choose a coating which cures with UV *and* visible light, you >might find a better result. The visible light travels farther, reflects and >bounces around into the nooks and crannies much better. > >Regards, >Peter >-- >-------------------------------------------------------- >Peter Swanson [log in to unmask] >INTERTRONICS http://www.intertronics.co.uk > > INTERTRONICS is dedicated to providing quality > material, consumable and equipment solutions to the > electronics manufacturing and other technology based > industries, with the highest levels of technical > support and customer service. > > >-----Original Message----- >From: Mike Manwell [mailto:[log in to unmask]] >Sent: 06 December 2001 14:41 >To: [log in to unmask] >Subject: [TN] 2 Conformal Coating ?'s > > >Hello, >Thanks in advance if you have taken the time to read this! > >#1- Im trying different materials in a spray application. Both are cured >using UV. One material does a "secondary cure" w/ moisture. This is cool >because after 100 hours after UV cure, all material is fully cured. >The other material Im trying uses HEAT for a secondary cure, or, if >shodowed during UV cure, the material wont cure and never will. Obviously I >dont want the stuff dripping or running anywhere, but being new to this >wonderful process, just dont feel good about leaving uncured material on a >product for it's entire life. Iv been told that you can "test" the product >to see if the uncured material is causing a problem but Im not sure what >type of test that would consist of. Any insight? > >#2- Has anyone out there ever installed refelctive metal plates in their UV >oven to limit shadowing? > >Thanks so much, > >Mike Manwell > >---------------------------------------------------------------------------- >----- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send the following message: SET >Technet NOMAIL >Search previous postings at: www.ipc.org > On-Line Resources & Databases > >E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >---------------------------------------------------------------------------- >----- >Date: Fri, 7 Dec 2001 13:36:13 -0500 >From: Charles McMahon <[log in to unmask]> >Subject: Re: SURFACE FINISHES >MIME-Version: 1.0 >Content-Type: text/plain; charset=us-ascii; format=flowed >Content-Transfer-Encoding: 7bit > >Hello Mr. Hillman: > >Thank you very much for your input. Your time is most appreciated. > >As a board supplier I do prefer ENIG when process control is superior >(black pad notwithstanding). However, it is the customer >who is King and our goal is to surpass their requirements for quality >and reliablity. As CM's are now a driving force as to vendor choice, >their needs >have become a primary influencer in choosing friendly surface finishes >beneficial to their process. > >What comments might you have relative to solderability problems found >specific to silver/gold/tin coatings. >When the design calls for fine pitch what do you choose for your >facility? And why? >Regarding silver again; would corrosion of the surface upon exposure to >flux be an issue at rework? >Secondly, when reflow issues arise, have you found them to be traced >back to the thickness of the silver itself (or lack of thickness)? > >One view is that as lead is taken out of the PCB fab process, one of >these alternative finishes will dominate. The driver will be >rework/touch-up flexibility as to which one wins. Would you agree? > >Your insights are thanked for in advance. > >Charlie McMahon >McMahon Sales Company > >David Hillman wrote: > >>Hi Charlie! I hadn't seen an assembler's response so I'll deposit mine for >>TechNet dissection. We have qualified immersion gold, immersion tin, and >>immersion silver as alternative pwb surface finishes for our manufacturing >>processes as HASL replacements. I don't foresee any one of the three >>alternatives as becoming "dominate" because each has both pro's and con's: >> >>Immersion gold: wonderfully flat, good long term solderability, good >>industry availability, BUT black pad issues, its a nasty chemistry on >>soldermask, and soldering to nickel is not soldering to copper >> >>Immersion tin: wonderfully flat, metallurgical compatibility, reworkable, >>BUT long term solderability issues, compatibility with soldermasks, and >>supply sources >> >>Immersion silver: wonderfully flat, reworkable, great RF design >>characteristics, BUT supply source issues, metallurgical questions, and >>long term solderability questions >> >>I think that the selection of an alternative surface finishes will become a >>question of materials organization within a particular manufacturing >>environment - HASL made our choices simpler but was definitely robustness >>limiting for certain manufacturing flows (like SMT fine pitch). >> >>Dave Hillman >>Rockwell Collins >>[log in to unmask] >> >> >> >> >> >>Charles McMahon <[log in to unmask]>@ipc.org> on 12/05/2001 11:33:26 AM >> >>Please respond to "TechNet E-Mail Forum." <[log in to unmask]> >> >>Sent by: TechNet <[log in to unmask]> >> >> >>To: [log in to unmask] >>cc: >> >>Subject: Re: [TN] SURFACE FINISHES >> >> >>EARL: >> >>Does your view hold the same from an assemblers point of view. >> >>More specifically, in your history, would the assembler prefer ENIG over >>SILVER and/or TIN? >>THe assemblers I speak with just do not have the background/experience to >>decide. However, they >>are quick to reject the bare board vendor for what they THINK is a >>solderability problem. >>(That's when I move with failure review etc. I hope to reduce this >>incidence >>dramatically by proposing user friendly finishes based on board design.) >> >>Charlie >> >>-----Original Message----- >>From: TechNet [mailto:[log in to unmask]]On Behalf Of Earl Moon >>Sent: Wednesday, December 05, 2001 12:14 PM >>To: [log in to unmask] >>Subject: Re: [TN] SURFACE FINISHES >> >> >>As a cost factor to you it's nickle and dime stuff. To most board shops I >>work with, it is as well. It's a matter of choice so much that it's almost >>subjective (whatever looks best though black pad isn't too pretty) - >>excluding HASL, or course. I hope you are right about its final demise. >> >>MoonMann >> >>---------------------------------------------------------------------------- >> >>----- >>Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >>To unsubscribe, send a message to [log in to unmask] with following text in >>the BODY (NOT the subject field): SIGNOFF Technet >>To temporarily halt delivery of Technet send the following message: SET >>Technet NOMAIL >>Search previous postings at: www.ipc.org > On-Line Resources & Databases > >>E-mail Archives >>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for >>additional >>information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >>ext.5315 >>---------------------------------------------------------------------------- >> >>----- >> >>-------------------------------------------------------------------------- >>------- >> >>Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >>To unsubscribe, send a message to [log in to unmask] with following text in >>the BODY (NOT the subject field): SIGNOFF Technet >>To temporarily halt delivery of Technet send the following message: SET >>Technet NOMAIL >>Search previous postings at: www.ipc.org > On-Line Resources & Databases > >>E-mail Archives >>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for >>additional >>information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >>ext.5315 >>-------------------------------------------------------------------------- >>------- >> >>-------------------------------------------------------------------------- >>------- >>Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >>To unsubscribe, send a message to [log in to unmask] with following text in >>the BODY (NOT the subject field): SIGNOFF Technet >>To temporarily halt delivery of Technet send the following message: SET >>Technet NOMAIL >>Search previous postings at: www.ipc.org > On-Line Resources & >>Databases > E-mail Archives >>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >>information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >>ext.5315 >>-------------------------------------------------------------------------- >>------- >> >> > > >Date: Fri, 7 Dec 2001 11:59:39 -0700 >From: Rick Howieson <[log in to unmask]> >Subject: Re: BGA Visual Inspection >MIME-Version: 1.0 >Content-Type: text/plain; charset="iso-8859-1" > >We purchased an ERSAScope recently after evaluating both X-Ray & ERSA. We >are now in the process of getting two more ESRAScopes. All the features have >been beneficial to us. >Rick Howieson >Delta Group Electronics, Inc. > >-----Original Message----- >From: Anderson, Greg (IndSys, GEFanuc, NA) >[mailto:[log in to unmask]] >Sent: Friday, December 07, 2001 9:44 AM >To: [log in to unmask] >Subject: [TN] BGA Visual Inspection > > > > TechNet Friends, > > We are looking into visual inspection of BGAs to supplement our > > X-Ray inspection. I am somewhat familiar with the ERSASCOPE. It appears > > to be a fully developed, well-thought out system, with all the options to > > make life easy. It appears that their supplemental tools in fact, do add > > value to the endoscope itself. This, of course, comes at a price. > > I'm hoping to hear from people who have personally evaluated such > > tools. > > Are all the features of the ERSA truly benefits? > > Are there other systems that do what the ERSASCOPE does? Are they > > as fully developed as the ERSA? > > > > Thanks for your help with this one, > > I > > > > Greg Anderson > > Senior Advanced Manufacturing Engineer > > GE Fanuc Automation > > Charlottesville, VA 22911 > > Phone: 434-978-5181 > > FAX: 434-978-5898 > > e-mail: [log in to unmask] > > > > > > > >---------------------------------------------------------------------------- >----- >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send the following message: SET >Technet NOMAIL >Search previous postings at: www.ipc.org > On-Line Resources & Databases > >E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >---------------------------------------------------------------------------- >----- >Date: Fri, 7 Dec 2001 14:44:17 -0500 >From: Graham Collins <[log in to unmask]> >Subject: Re: BGA Visual Inspection >MIME-Version: 1.0 >Content-Type: text/plain; charset=US-ASCII > >Hi Greg! >We recently bought an ErsaScope, after checking out the alternatives at >Apex last year. There are a couple of companies making similar products, >for similar prices. We went with the Ersa system. The Ersa seems more >fully developed than the others - purpose built vs adapted. And viewing >on the PC gives you some flexibility that the others didn't - just live >video monitors typically. > >The ErsaScope comes with some well developed software. Will you truly use >all it's functions?? It depends, but we don't. The defect / QA library it >comes with - we don't use. We use it for inspection, and for >documenting things like problem parts.. It's great for taking >pictures. We didn't go for the Magniscope option, if I had to do it again >I might. > >regards > >Graham Collins >Process Engineer, >Northrop Grumman >Atlantic Facility of Litton Systems Canada >(902) 873-2000 ext 6215 > > >>> [log in to unmask] 12/07/01 12:43PM >>> > > TechNet Friends, > > We are looking into visual inspection of BGAs to supplement our > > X-Ray inspection. I am somewhat familiar with the ERSASCOPE. It appears > > to be a fully developed, well-thought out system, with all the options to > > make life easy. It appears that their supplemental tools in fact, do add > > value to the endoscope itself. This, of course, comes at a price. > > I'm hoping to hear from people who have personally evaluated such > > tools. > > Are all the features of the ERSA truly benefits? > > Are there other systems that do what the ERSASCOPE does? Are they > > as fully developed as the ERSA? > > > > Thanks for your help with this one, > > I > > > > Greg Anderson > > Senior Advanced Manufacturing Engineer > > GE Fanuc Automation > > Charlottesville, VA 22911 > > Phone: 434-978-5181 > > FAX: 434-978-5898 > > e-mail: [log in to unmask] > > > > > > > >--------------------------------------------------------------------------- >------ >Technet Mail List provided as a free service by IPC using LISTSERV 1.8d >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt delivery of Technet send the following message: SET >Technet NOMAIL >Search previous postings at: www.ipc.org > On-Line Resources & Databases > >E-mail Archives >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 >ext.5315 >--------------------------------------------------------------------------- >------ Hi, I will be back on 12/17/01. Regards, Jong