Bev: Based on what you have seen of the PPT and at NORTEL specifically, is it a viable alternative to stencil application of paste for pitches under.020. One of my board resources has utilized this for a client and it has worked nicely and as advertised. Have you has success with this technique? Charlie McMahon -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Bev Christian Sent: Wednesday, December 05, 2001 6:21 PM To: [log in to unmask] Subject: Re: [TN] SiPAD Jerry, The three built-up types I know of are Optipad, SiPAD and PPT. They were invented by, I think, DuPont, Siemens and Mask Technology Inc. The former two are fairly similar, the latter involves drawing solder to pads with a stainless steel mesh put across the board. Nortel Networks used the latter to deal with a tricky situation where a placement machine was flinging parts around combined with an inability to put solder paste on the secondary side. regards, Bev Christian Research in Motion -----Original Message----- From: Jerry Mosur [mailto:[log in to unmask]] Sent: December 5, 2001 4:44 PM To: [log in to unmask] Subject: Re: [TN] SiPAD Good question. Luckily we don't have a need for double sided SMT, we are just getting into SS SMT. On the other hand, it is somewhat difficult to design a 20kV power supply with SMT components. -----Original Message----- From: Furrow, Robert Gordon (Bob) [mailto:[log in to unmask]] Sent: Wednesday, December 05, 2001 4:21 PM To: [log in to unmask] Subject: Re: [TN] SiPAD What happens with double sided SMT which is becoming more prevalent? Thanks, Robert Furrow Printed Wiring Board Engineer Strategic Supply Global Account Manager Supply Chain Networks Lucent Technologies 978-960-3224 [log in to unmask] -----Original Message----- From: Jerry Mosur [mailto:[log in to unmask]] Sent: Wednesday, December 05, 2001 4:15 PM To: [log in to unmask] Subject: [TN] SiPAD Greetings, Our assembly guys came across a PCB product called SiPAD. It is a patented (by Siemens) way of adding a layer of SMD paste, then curing and leveling it and finally spraying the whole board with a layer of flux. A layer of protective paper is applied over the entire surface so the flux doesn't dry out and stays tacky. The claim to fame is that it is suppose to save one manufacturing step, solder paste application. Any comments? Thanks in advance. ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------