Hi All,
I asked for some of this information before, but got no response. I am trying
to assess the impact of the various thermal masses of components on their
different reflow temperature profiles.
However, I do not have enough information. I would appreciate any information
any of you could provide. Components of interest are listed below, the number
of I/O's could vary of course. What I need is body dimensions, possible chip
sizes, component substrate thickness, metal content, etc.:
0603 Chip
1803 Chip
100 I/O QFP
Plastic 361 I/O BGA
Plastic 361 I/O SBGA
Ceramic 361 I/O BGA

Thanks,
Werner Engelmaier

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------