Hi All, I asked for some of this information before, but got no response. I am trying to assess the impact of the various thermal masses of components on their different reflow temperature profiles. However, I do not have enough information. I would appreciate any information any of you could provide. Components of interest are listed below, the number of I/O's could vary of course. What I need is body dimensions, possible chip sizes, component substrate thickness, metal content, etc.: 0603 Chip 1803 Chip 100 I/O QFP Plastic 361 I/O BGA Plastic 361 I/O SBGA Ceramic 361 I/O BGA Thanks, Werner Engelmaier --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------