HA! I imagine that this patent is as enforcable as the one that "patented" using epoxy for bottomside SMT components...

Were these companies to try and enforce such patents, the losses that they would see from such enforcement, should be of much concern to the upper management.

If they even attempted such enforment, I for one, would do everything in my power to not engage in any sort of business with that company...it would be possible to do that...they have a great stake in other markets...there's many other companies that produce memory as one example...I don't think they would be so short sighted...

-Steve Gregory-

Technetters...

I have been reading the suggestions about how one
verifies that laminate layers are stacked correctly.

Did you know that a company, Samsung, has actually
"patented" the idea of using offset metal pads near
the edges of the substrate to determine that the
layup is correct.

No way! Yes way! - patent number 6,091,026 (I saw the
patent reviewed in Chip Scale Design Magazine...November
December 2001, page 57)

So all of you using the technique - send your money
to Samsung! And I though that patents had to be non-obvious
to those skilled in the industry ...

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Steve DiBartolomeo [log in to unmask]
PC Tools Microelectronics Tools