I am trying to do some repairs on vias of an assembled board that were damaged due to test technicians scraping soldermask for ICT. The vias show signs of thinning/cracking at the knee. IPC 7721 shows that using eyelets are the acceptable repair for plated thru holes but they do not address vias anywhere that I am aware of. I can't imagine putting eyelets into a via. I am considering putting a solid wire into the via and filling it with solder to make the connection from top to bottom. Is this acceptable? If not then what is an acceptable method of repair? Any input would be appreciated. Sincerely Jim _________________________________________________________________ Get your FREE download of MSN Explorer at http://explorer.msn.com/intl.asp --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------