Hi Stella! Just one bit of information to add to Steve's great information - use the IPC JSTD-002A solderability specification as you tool/method of demonstrating that the solderability and/or leaching is your problem. We have experienced similar problems in the past and poor solderability of the components was problem. Dave Hillman Rockwell Collins [log in to unmask] Stella Neyman <[log in to unmask]>@ipc.org> on 12/05/2001 05:53:55 PM Please respond to "TechNet E-Mail Forum." <[log in to unmask]> Sent by: TechNet <[log in to unmask]> To: [log in to unmask] cc: Subject: [TN] Platinum/Palladium/Silver plating Dear technetts, Please help me out. We are introducing new custom made SMT component: Medium size (approx. 0.5" x 0.200") with 2 ceramic terminations that plated with Pt/Pd/Ag coating. Solder paste for our reflow process is 63Sn/37Pb NC low residue. Reflow profile is standard for this paste reflow peak temp of 220-225 deg C and 50 sec above 183 deg C. We are experiencing non-wetting conditions on components terminations, some solder joints cracked during thermocycling testing. Does anybody experience problem with Pt/Pd/Ag coating over ceramic substrate? Any information would be greatly appreciated. Sincerely Stella Neyman Jabil Circuit, MI --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------