Greetings, Our assembly guys came across a PCB product called SiPAD. It is a patented (by Siemens) way of adding a layer of SMD paste, then curing and leveling it and finally spraying the whole board with a layer of flux. A layer of protective paper is applied over the entire surface so the flux doesn't dry out and stays tacky. The claim to fame is that it is suppose to save one manufacturing step, solder paste application. Any comments? Thanks in advance. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------