Hello Technetters, Thank you so much! You guys are awesome! Yes Steve, thanks for your input, you don't mind if I quote it in my report "50,000/year just for waste solder paste on X-out modules for 1 mil module/month" (our volume is about not less). The problem of X-Out, from my concern, is how to provide good support in Solder Paste Printing process as we do second side product. Width different component height (D-Pac Stack, TSOP, SOJ, high/low profile capacitors, different PCB thickness), it is not easy to find flexible/cost effitive tool for the support toolings. Even with one product but the X-Out position shift from block to block. THE SECOND QUESTION IS PCB HEIGHT. WE WANT THE LAYOUT ENGINEER TO FOLLOW THE 0.125 INCREMENT. (I.e for DIMM, the dimension will be 5.25x1.00/1.125/1.250/1.375...) By doing we can standardize the panel size, the tools, fixture, etc. However, I do not know is there any JDEC spec or any other spec on PCB height or its increment. Please advise, Stacy __________________________________________________ Do You Yahoo!? Send your FREE holiday greetings online! http://greetings.yahoo.com --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------