Hi Pat, The footprint for wave soldering is ofcourse diferent than the one for reflow, the difference being the extra protrusion of the pad outside the component termination and also the gap between the two pads. Also to be taken care is the orientation of the chip components. Preferably they should be perpendicular to the PCB flow direction, thus enabling both the pads to contact the wave simultaneously. This will have the most visible effect on the tall bodied ceramic caps. In case the comps are parallel to the PCB flow direction, for the tall bodied caps you'll see insufficient or no solder at the trailing pad. However, if you have the dual wave soldering machine, this effect will be minimized, if not eliminated. For wave soldering SMTs, you need to glue them in order to hold them in place during wave soldering. Where does the solder paste come into the picture? What is your purpose of using the solder paste? Not required! Hope this info is of use. Regards Vinit -----Original Message----- From: Patrick Lam [mailto:[log in to unmask]] Sent: Thursday, December 20, 2001 3:16 AM To: [log in to unmask] Subject: [TN] Wave solder 0603 Hi TechNetters, I need some advice on putting 0603 parts on the bottom. Should the footprint be different than the one for reflow? What is the preferred footprint? Is it a good pratice to use both glue dots and solder paste for wave sodering? Thanks, Patrick This e-mail may contain SEL confidential information. The opinions expressed are not necessarily those of SEL. Any unauthorized disclosure, distribution or other use is prohibited. If you received this e-mail in error, please notify the sender, permanently delete it, and destroy any printout. Thank you. ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------