Hi Kathie! Sorry for a silly question but why are you baking the boards? Material reason, process reason, etc. ? Dave Hillman Rockwell Collins [log in to unmask] "Lambert, Katherine A." <[log in to unmask]>@ipc.org> on 12/18/2001 09:35:58 AM Please respond to "TechNet E-Mail Forum." <[log in to unmask]> Sent by: TechNet <[log in to unmask]> To: [log in to unmask] cc: Subject: [TN] Board baking & sealable bags Hi folks, Currently we bake our boards and store them in nitrogen cabinets until we are ready to use the boards on our automated line. Typically, turn around is fairly quick - within a week - but occasionally is more than a month due to other part shortages. We are trying to streamline the process a bit and get rid of the nitrogen cabinets as they take up a lot of space, and the boards become separated from the rest of the kit, etc. We are looking at a bake & bag process. We would bake the boards, seal them in appropriate bags with a humidity indicator card, and send them to the assembly area with the rest of the kit. Desiccants are not an option as they typically have caused our panelized boards to break. We have a variety of board types - polyimide, epoxy-glass, etc. Since the folks around here like a one-size-fits-all process, we need to develop the process around the most sensitive board type. Now for the questions: 1. Where is a good source for information regarding sealable or resealable bags that are reasonably impermeable to ambient humidity? Our relative humidity levels typically run between 30% & 50% 2. We have a bag sealer, but will a zip-lock type bag work just as well? 3. Where is a good source for information regarding humidity indicator cards? 4. Is there any reliable information regarding how long a baked board can be exposed to ambient humidity before it has to be rebaked? Thanks for any insight you can provide. Kathie Lambert Process Engineer Northrop Grumman Baltimore, MD 410-765-9746 --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------