Greetings, You can rework any BGA on either side of the board. The baking procedures must be follow to ensure no moisture is in the packages during the reflow processes. using the rework station (Air-vac) to remove the BGA, clean all pads and using mini stencil to reinstall the new BGA ( mini stencil can be eliminate by using No-Clean flux paste) The best reflow method is using your convection oven by placing the board on the rail or off the belt. Placing the new BGA on top and reflow thru the convection oven and the other on the bottom. With liquid surface tension of the reflow solder will be more than enough to hold the bottom BGA in place during reflow. You can inspect for short with X-ray at 0 degree and openned pins at 75 degree tilt. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------