Greetings,
You can rework any BGA on either side of the board. The baking procedures
must be follow to ensure no moisture is in the packages during the reflow
processes. using the rework station (Air-vac) to remove the BGA, clean all
pads and using mini stencil to reinstall the new BGA ( mini stencil can be
eliminate by using No-Clean flux paste) The best reflow method is using your
 convection oven by placing the board on the rail or off the belt. Placing
the new BGA on top and reflow thru the convection oven and the other on the
bottom. With liquid surface tension of the reflow solder will be more than
enough to hold the bottom BGA in place during reflow. You can inspect for
short with X-ray at 0 degree and openned pins at 75 degree tilt.

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------