Good morning all. I am dealing with a very hot manufacturing, er, um... challenge, right now. On one of our assemblies, we are having a hell of a time getting our Humiseal 1B31 to stick to the assembly surface (solder mask). One of the remedial measures I am trying for work in progress, whilst I work on the root cause, is to plasma treat the assemblies: 750 mTorr, 100 watts, argon plasma, 5 minutes. Our plasma expert does not think these settings will have detrimental effects on the assembly. I am also looking at the mask and other process related possibilities. Here is my problem, well actually a problem within a problem, anyway.... The plasma cleaner is in our microelectronics clean room. Depending on where it is in the process, some of the assemblies have silicone RTV on them and the microelectronics folks are rightly concerned with silicone cross contamination. This cleaner is used for cleaning die prior to bonding and silicone contamination would be a *big* problem. The question: what kind of cleaning protocol would you recommend on a plasma chamber to get any outgassed products and how would you verify no cross contamination? Dow suggests using their OS2 cleaner. I am inclined to use acetone and then run an oxygen plasma after that to ash any organics. Suggestions? Doug Pauls Rockwell Collins --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------