> -----Original Message----- > From: jong s kadesch [SMTP:[log in to unmask]] > Sent: Monday, December 17, 2001 9:58 AM > To: [log in to unmask] > Subject: [TN] Jong on Vacation (was Re: TechNet Digest - 14 Dec 2001 > - Special issue (#2001-778)) > > At 02:57 PM 12/14/01 -0600, you wrote: > > > Date: Fri, 14 Dec 2001 14:57:26 -0600 > Reply-To: TechNet <[log in to unmask]> > Sender: TechNet <[log in to unmask]> > From: Automatic digest processor <[log in to unmask]> > Subject: TechNet Digest - 14 Dec 2001 - Special issue (#2001-778) > To: Recipients of TechNet digests <[log in to unmask]> > > There are 12 messages totalling 927 lines in this issue. > > Topics in this special issue: > > 1. IPC Supplier Audit Guidelines > 2. Alumina filled Polysulfide compound... (4) > 3. EPA TRI reporting of lead usage > 4. photoplotters (2) > 5. Homeplate apertures, how to use them (3) > 6. Alumina filled Polysulfide compound... What Did Charles Say? > > > -------------------------------------------------------------------------- > ------- > Technet Mail List provided as a free service by IPC using LISTSERV > 1.8d > To unsubscribe, send a message to [log in to unmask] with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: > SET Technet NOMAIL > Search previous postings at: www.ipc.org <http://www.ipc.org/> > > On-Line Resources & Databases > E-mail Archives > Please visit IPC web site ( <http://www.ipc.org/html/forum.htm>) for > additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > > -------------------------------------------------------------------------- > ------- > Date: Fri, 14 Dec 2001 08:33:41 -0700 > From: Rick Howieson <[log in to unmask]> > Subject: Re: IPC Supplier Audit Guidelines > MIME-Version: 1.0 > Content-Type: multipart/alternative; > boundary="----_=_NextPart_001_01C184B4.B57E7D70" > > 1710 is more of a supplier profile and not an audit guideline. It > will give you an idea of what a board shop can accomplish compared to your > design but does not get into how a fabricator controls their process. > Rick > > > > -----Original Message----- > From: Stephen R. Gregory [ > <mailto:[log in to unmask]>] > Sent: Wednesday, December 12, 2001 3:09 PM > To: [log in to unmask] > Subject: Re: [TN] IPC Supplier Audit Guidelines > > > Hi Jana, > > > Go to www.ipc.org <http://www.ipc.org/>, then click > on Online Resources and Databases, then scroll all the way down to IPC > Documents Available for Download and click on that. > > > You will find: > > > IPC-1710 OEM > Standard for Printed Board Manufacturers' > Qualification Profile > > > Developed by the OEM council of the IPC, the MQP > sets the standard for assessing PWB manufacturers capabilities and allows > PWB manufacturers to more easily satisfy customer requirements. > > > IPC-1720 > Assembly Qualification Profile Developed by the OEM > council of the IPC, IPC-1720 categorized an electronic assembly > manufacturer's capabilities and supplies the OEM customer with detailed, > substantive information. > > > IPC-1730A > Laminator Qualifier Profile > Are you a laminate manufacturer looking to provide > your customers with a consistent, detailed report on your facility(s)? > IPC-1730A is the one tool laminate manufacturers can use to provide > current and potential customers with a profile of their facilities. By > completing this questionnaire, laminators can provide information on > materials supplied, approvals and certifications, testing available, > equipment capabilities and more! > > > IPC-1731 > Strategic Raw Materials Supplier Qualification > Profile (SRMSQP) > Suppliers of raw materials to laminate manufacture > now have an industry approved questionaire to supply current and potential > customers with a self assessment of their facility(s). IPC-1731 gives > suppliers of raw materials the opportunity to create a profile of their > manufacturing facility(s) that will be consistent with those developed by > similar suppliers. Using the MS Word template enables easy creation and > maintenance of the file(s) and provide their customers with an electronic > file for their records. > > > -Steve Gregory- > > > > > > > > > > > > > > > > Greetings All, > > > I have in the back of my mind, a dusty place indeed, > that IPC had a document > containing Supplier Audit guidelines. I have surfed > the IPC site and do not > find such a document in the Technical Publications > pdf. Does IPC have > something like this, or ... I'm losing it! > Thanks for the help, > Jana Carraway > Micro Systems Engineering, Inc. > > > > > > > > > > > > > > > > > > > > Date: Fri, 14 Dec 2001 08:27:33 -0800 > From: "Barmuta, Mike" <[log in to unmask]> > Subject: Re: Alumina filled Polysulfide compound... > MIME-Version: 1.0 > Content-Type: text/plain; charset="iso-8859-1" > > Steve: > Take a look at MIL-S-8516 Sealing Compound, Polysulfide > Rubber, Electrical > Connectors and Electrical Systems, Chemically Cured. I think > this is more in > line with what you are doing than 8802. > Polysulfde compounds have been around a long time, however > for electrical > applications I think most have been replaced by urethanes > and silicones. > > > > Good Luck ! > > Michael Barmuta > > Staff Engineer > > Fluke Corp. > > Everett WA > > 425-446-6076 > > > -----Original Message----- > From: Stephen R. Gregory [ <mailto:[log in to unmask]>] > Sent: Friday, December 14, 2001 6:26 AM > To: [log in to unmask] > Subject: [TN] Alumina filled Polysulfide compound... > > > Hi All!! > > ....tappity-tappity-tappity...(doin' my thank gawd it's > Friday dance! hehehe) > > > I was wondering if someone could point me in a direction > where I could find > some alumina filled polysulfide compound, per MIL-S-8802, > class A-2, with 50 > plus or minus 10%, 325 mesh aluminum oxide powder... > > This is something that is called out on a drawing for a > board that's using > this material to strain relief two small battery cables that > are installed > on the board...I've searched and find a bunch of stuff about > polysulfide > compounds, but nothing alumina filled. If I search under > MIL-S-8802, I find > all kinds of polysulfide sealers for jet fuel tanks, but > still nothing > alumina filled... > > Any help will be much appreciated > > -Steve Gregory- > Date: Fri, 14 Dec 2001 11:30:16 -0500 > From: Gregg Klawson <[log in to unmask]> > Subject: Re: Alumina filled Polysulfide compound... > MIME-Version: 1.0 > Content-Type: text/plain; format=flowed; charset=us-ascii > > Hi Steve, > > You can always buy the alumina powder and polysulfide > compound separately > and mix 'em together. I've seen this done successfully with > various > adhesive materials, not sure if we ever did it with a > polysulfide though. > > Good luck, > Gregg > > At 09:26 AM 12/14/01, Stephen R. Gregory wrote: > > > Hi All!! > > ...tappity-tappity-tappity...(doin' my thank gawd > it's Friday dance! hehehe) > > I was wondering if someone could point me in a > direction where I could > find some alumina filled polysulfide compound, per > MIL-S-8802, class A-2, > with 50 plus or minus 10%, 325 mesh aluminum oxide > powder... > > This is something that is called out on a drawing > for a board that's using > this material to strain relief two small battery > cables that are installed > on the board...I've searched and find a bunch of > stuff about polysulfide > compounds, but nothing alumina filled. If I search > under MIL-S-8802, I > find all kinds of polysulfide sealers for jet fuel > tanks, but still > nothing alumina filled... > > Any help will be much appreciated > > -Steve Gregory- > > > > Date: Fri, 14 Dec 2001 11:56:31 -0500 > From: Phil Nutting <[log in to unmask]> > Subject: EPA TRI reporting of lead usage > MIME-Version: 1.0 > Content-Type: text/plain; charset="iso-8859-1" > > This topic (lead usage and disposal reporting) got bounced > around > several months ago. I know the IPC has spoken to the > go'ment about the > ramifications this ruling brings and it is my understanding > that the > feds turned a deaf ear to them. So, to that end, has anyone > attempted > to figure out what we (as small OEMs building electronic > devices that > include circuit boards) are supposed to submit to the feds > in the way of > reporting? I've attempted to wade through the EPA documents > and wish > there was a "Cliff Notes" version so I can figure out what > we are > supposed to do without having to hire an expensive > consultant. > > Have I just opened a can of worms? > > Phil Nutting > Date: Fri, 14 Dec 2001 08:58:18 -0800 > From: Karla Thompson <[log in to unmask]> > Subject: Re: photoplotters > MIME-Version: 1.0 > Content-Type: text/plain; charset="iso-8859-1" > > Thanks for the replies. > Anyone have an EIE plotter? Specifically the RP200 line? > > > > -----Original Message----- > From: Mark Hargreaves [ <mailto:[log in to unmask]>] > Sent: Friday, December 14, 2001 04:28 > To: [log in to unmask] > Subject: Re: photoplotters > > > Hi Karla, > We currently have a 3-4 year old CSI (guess it's Gretag now) > plotter. We're > happy with the images, speed and up-time. > > Regards, > Mark Hargreaves > EMDS > > -----Original Message----- > From: Karla Thompson [SMTP:[log in to unmask]] > Sent: Thursday, December 13, 2001 6:28 PM > To: [log in to unmask] > Subject: [TN] photoplotters > > I'm in the process of looking at Photoplotters and > would appreciate > any > input any of you may have. We currently have a 5-6 > year old Barco > Crescent > 30. I'm looking at EIE, Orbotech, and Barco/Mania. > If any of you > have any > comments on those, or any others (?) I'd appreciate > it. > > > Karla Thompson > CAM Technician > Electronic Controls Design, Inc > Tel: (503) 829-9108 > email: [log in to unmask] > > > > -------------------------------------------------------------------------- > -- > ----- > Technet Mail List provided as a free service by IPC > using LISTSERV > 1.8d > To unsubscribe, send a message to [log in to unmask] > with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the > following message: > SET Technet NOMAIL > Search previous postings at: www.ipc.org > <http://www.ipc.org/> > On-Line Resources & > Databases > E-mail Archives > Please visit IPC web site ( > <http://www.ipc.org/html/forum.htm>) for > additional > information, or contact Keach Sasamori at > [log in to unmask] or > 847-509-9700 ext.5315 > > > -------------------------------------------------------------------------- > -- > ----- > > > -------------------------------------------------------------------------- > -- > ----- > Technet Mail List provided as a free service by IPC using > LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with > following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following > message: SET > Technet NOMAIL > Search previous postings at: www.ipc.org > <http://www.ipc.org/> > On-Line Resources & Databases > > E-mail Archives > Please visit IPC web site ( > <http://www.ipc.org/html/forum.htm>) for additional > information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 > ext.5315 > > -------------------------------------------------------------------------- > -- > ----- > Date: Fri, 14 Dec 2001 12:45:47 -0500 > From: Brock Hunter <[log in to unmask]> > Subject: Re: photoplotters > MIME-Version: 1.0 > Content-Type: text/plain; charset=us-ascii > Content-Transfer-Encoding: 7bit > > Karla, > > We have an EIE RP-508 and have only been down once in the > past 14 months. Overall we are quite > pleased with it. Initially it was intended to supplement our > CSI FIRE 9300 and quickly took > over all the work, typically 130 - 150 plots ( 24 X 30 ) per > day. > > Cheers, > > Brock > > Karla Thompson wrote: > > > Thanks for the replies. > > Anyone have an EIE plotter? Specifically the RP200 line? > > > > -----Original Message----- > > From: Mark Hargreaves [ <mailto:[log in to unmask]>] > > Sent: Friday, December 14, 2001 04:28 > > To: [log in to unmask] > > Subject: Re: photoplotters > > > > Hi Karla, > > We currently have a 3-4 year old CSI (guess it's Gretag > now) plotter. We're > > happy with the images, speed and up-time. > > > > Regards, > > Mark Hargreaves > > EMDS > > > > -----Original Message----- > > From: Karla Thompson [SMTP:[log in to unmask]] > > Sent: Thursday, December 13, 2001 6:28 PM > > To: [log in to unmask] > > Subject: [TN] photoplotters > > > > I'm in the process of looking at Photoplotters and > would appreciate > > any > > input any of you may have. We currently have a 5-6 > year old Barco > > Crescent > > 30. I'm looking at EIE, Orbotech, and > Barco/Mania. If any of you > > have any > > comments on those, or any others (?) I'd > appreciate it. > > > > Karla Thompson > > CAM Technician > > Electronic Controls Design, Inc > > Tel: (503) 829-9108 > > email: [log in to unmask] > > > > > -------------------------------------------------------------------------- > -- > > ----- > > Technet Mail List provided as a free service by > IPC using LISTSERV > > 1.8d > > To unsubscribe, send a message to [log in to unmask] > with following > > text in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt delivery of Technet send the > following message: > > SET Technet NOMAIL > > Search previous postings at: www.ipc.org > <http://www.ipc.org/> > On-Line Resources & > > Databases > E-mail Archives > > Please visit IPC web site ( > <http://www.ipc.org/html/forum.htm>) for > > additional > > information, or contact Keach Sasamori at > [log in to unmask] or > > 847-509-9700 ext.5315 > > > > > -------------------------------------------------------------------------- > -- > > ----- > > > > > -------------------------------------------------------------------------- > -- > > ----- > > Technet Mail List provided as a free service by IPC using > LISTSERV 1.8d > > To unsubscribe, send a message to [log in to unmask] with > following text in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt delivery of Technet send the following > message: SET > > Technet NOMAIL > > Search previous postings at: www.ipc.org > <http://www.ipc.org/> > On-Line Resources & Databases > > > E-mail Archives > > Please visit IPC web site ( > <http://www.ipc.org/html/forum.htm>) for additional > > information, or contact Keach Sasamori at [log in to unmask] > or 847-509-9700 > > ext.5315 > > > -------------------------------------------------------------------------- > -- > > ----- > > > > > -------------------------------------------------------------------------- > ------- > > Technet Mail List provided as a free service by IPC using > LISTSERV 1.8d > > To unsubscribe, send a message to [log in to unmask] with > following text in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt delivery of Technet send the following > message: SET Technet NOMAIL > > Search previous postings at: www.ipc.org > <http://www.ipc.org/> > On-Line Resources & Databases > E-mail Archives > > Please visit IPC web site ( > <http://www.ipc.org/html/forum.htm>) for additional > > information, or contact Keach Sasamori at [log in to unmask] > or 847-509-9700 ext.5315 > > > -------------------------------------------------------------------------- > ------- > > -- > Brock Hunter [log in to unmask] > Engineering Mgr. > Dynamic & Proto Circuits > TEL (905) 643-9900 > FAX (905) 643-9437 > <http://www.dapc.com/> > Date: Fri, 14 Dec 2001 12:56:32 -0500 > From: Jeff Seeger <[log in to unmask]> > Subject: Re: Homeplate apertures, how to use them > MIME-Version: 1.0 > Content-Type: text/plain; charset=us-ascii > Content-Transfer-Encoding: 7bit > > "d. terstegge" wrote: > > > > snip < > > How do others deal with this ? Mabe you have suggestions > on how to make an easier-to-use specification ? Or ideas about easier > ways to order a stencil according to my spec ? > > > Wouldn't this be handled best in design? That way > it can > be a part of the footprint and happen "by itself". > > Most of the dense boards I've seen lately are very > difficult > to determine which pads relate to each other with > any degree > of certainty. Silkscreens are so compromised as to > not be > reliable indicators. > > Just a thought, > -- > > Jeff Seeger Applied CAD > Knowledge Inc > Chief Technical Officer Tyngsboro, MA > 01879 > jseeger "at" appliedcad "dot" com 978 > 649 9800 > Date: Fri, 14 Dec 2001 13:17:25 -0600 > From: Charles Caswell <[log in to unmask]> > Subject: Re: Alumina filled Polysulfide compound... > MIME-Version: 1.0 > Content-Type: text/plain; charset="utf-8" > > Steve, I am at home so I don't have the info here . We use > the same > stuff to bond components on some boards. I don't think you > will find the > stuff already mixed with the AlO2. I couldn't. The > polysulfide IS fuel > tank sealant. We mix it in small batches with approx. equal > parts of > AlO2 and the base material by weight. I wonder if we have > the same > customer. I will try to get into work tommorow and send some > info, if > not then on Mon. By the way, the stuff stinks. > Charles Caswell > Process Lead, PCB > Frontier Electronic Systems > > -----Original Message----- > From: Stephen R. Gregory > Sent: Fri 12/14/2001 8:26 AM > To: [log in to unmask] > Cc: > Subject: [TN] Alumina filled Polysulfide compound... > > > Hi All!! > > ...tappity-tappity-tappity...(doin' my thank gawd > it's Friday > dance! hehehe) > > I was wondering if someone could point me in a > direction where I > could find some alumina filled polysulfide compound, per > MIL-S-8802, > class A-2, with 50 plus or minus 10%, 325 mesh aluminum > oxide powder... > > This is something that is called out on a drawing > for a board > that's using this material to strain relief two small > battery cables > that are installed on the board...I've searched and find a > bunch of > stuff about polysulfide compounds, but nothing alumina > filled. If I > search under MIL-S-8802, I find all kinds of polysulfide > sealers for jet > fuel tanks, but still nothing alumina filled... > > Any help will be much appreciated > > -Steve Gregory- > > Date: Fri, 14 Dec 2001 14:38:40 EST > From: "Stephen R. Gregory" <[log in to unmask]> > Subject: Re: Alumina filled Polysulfide compound... > MIME-Version: 1.0 > Content-Type: multipart/alternative; > boundary="part1_16b.5ac614f.294baf40_boundary" > > Hi Charles, > > Sorry, but I didn't understand a word you said... > > -Steve Gregory- > > In a message dated 12/14/01 1:17:12 PM Central Standard > Time, [log in to unmask] writes: > > > > > > U3RldmUsIEkgYW0gYXQgaG9tZSBzbyBJIGRvbid0IGhhdmUgdGhlIGluZm8gaGVyZSAuIFdlIH > Vz > > ZSB0aGUgc2FtZQ0Kc3R1ZmYgdG8gYm9uZCBjb21wb25lbnRzIG9uIHNvbWUgYm9hcmRzLiBJIG > Rv > > bid0IHRoaW5rIHlvdSB3aWxsIGZpbmQgdGhlDQpzdHVmZiBhbHJlYWR5IG1peGVkIHdpdGggdG > hl > > IEFsTzIuIEkgY291bGRuJ3QuIFRoZSBwb2x5c3VsZmlkZSBJUyBmdWVsDQp0YW5rIHNlYWxhbn > Qu > > IFdlIG1peCBpdCBpbiBzbWFsbCBiYXRjaGVzIHdpdGggYXBwcm94LiBlcXVhbCBwYXJ0cyBvZg > 0K > > QWxPMiBhbmQgdGhlIGJhc2UgbWF0ZXJpYWwgYnkgd2VpZ2h0LiBJIHdvbmRlciBpZiAgd2UgaG > F2 > > ZSB0aGUgc2FtZQ0KY3VzdG9tZXIuIEkgd2lsbCB0cnkgdG8gZ2V0IGludG8gd29yayB0b21tb3 > Jv > > dyBhbmQgc2VuZCBzb21lIGluZm8sIGlmDQpub3QgdGhlbiBvbiBNb24uIEJ5IHRoZSB3YXksIH > Ro > > ZSBzdHVmZiBzdGlua3MuDQpDaGFybGVzIENhc3dlbGwNClByb2Nlc3MgTGVhZCwgUENCDQpGcm > 9u > > dGllciBFbGVjdHJvbmljIFN5c3RlbXMNCg0KCS0tLS0tT3JpZ2luYWwgTWVzc2FnZS0tLS0tIA > 0K > > CUZyb206IFN0ZXBoZW4gUi4gR3JlZ29yeSANCglTZW50OiBGcmkgMTIvMTQvMjAwMSA4OjI2IE > FN > > IA0KCVRvOiBUZWNoTmV0QElQQy5PUkcgDQoJQ2M6IA0KCVN1YmplY3Q6IFtUTl0gQWx1bWluYS > Bm > > aWxsZWQgUG9seXN1bGZpZGUgY29tcG91bmQuLi4NCgkNCgkNCglIaSBBbGwhISANCgkNCgkuLi > 50 > > YXBwaXR5LXRhcHBpdHktdGFwcGl0eS4uLihkb2luJyBteSB0aGFuayBnYXdkIGl0J3MgRnJpZG > F5 > > DQpkYW5jZSEgaGVoZWhlKSANCgkNCglJIHdhcyB3b25kZXJpbmcgaWYgc29tZW9uZSBjb3VsZC > Bw > > b2ludCBtZSBpbiBhIGRpcmVjdGlvbiB3aGVyZSBJDQpjb3VsZCBmaW5kIHNvbWUgYWx1bWluYS > Bm > > aWxsZWQgcG9seXN1bGZpZGUgY29tcG91bmQsIHBlciBNSUwtUy04ODAyLA0KY2xhc3MgQS0yLC > B3 > > aXRoIDUwIHBsdXMgb3IgbWludXMgMTAlLCAzMjUgbWVzaCBhbHVtaW51bSBveGlkZSBwb3dkZX > Iu > > Li4gDQoJDQoJVGhpcyBpcyBzb21ldGhpbmcgdGhhdCBpcyBjYWxsZWQgb3V0IG9uIGEgZHJhd2 > lu > > ZyBmb3IgYSBib2FyZA0KdGhhdCdzIHVzaW5nIHRoaXMgbWF0ZXJpYWwgdG8gc3RyYWluIHJlbG > ll > > ZiB0d28gc21hbGwgYmF0dGVyeSBjYWJsZXMNCnRoYXQgYXJlIGluc3RhbGxlZCBvbiB0aGUgYm > 9h > > cmQuLi5JJ3ZlIHNlYXJjaGVkIGFuZCBmaW5kIGEgYnVuY2ggb2YNCnN0dWZmIGFib3V0IHBvbH > lz > > dWxmaWRlIGNvbXBvdW5kcywgYnV0IG5vdGhpbmcgYWx1bWluYSBmaWxsZWQuIElmIEkNCnNlYX > Jj > > aCB1bmRlciBNSUwtUy04ODAyLCBJIGZpbmQgYWxsIGtpbmRzIG9mIHBvbHlzdWxmaWRlIHNlYW > xl > > cnMgZm9yIGpldA0KZnVlbCB0YW5rcywgYnV0IHN0aWxsIG5vdGhpbmcgYWx1bWluYSBmaWxsZW > Qu > > Li4gDQoJDQoJQW55IGhlbHAgd2lsbCBiZSBtdWNoIGFwcHJlY2lhdGVkIA0KCQ0KCS1TdGV2ZS > BH > cmVnb3J5LSANCgkNCg0K > > > > Date: Fri, 14 Dec 2001 21:24:28 +0100 > From: "D.Terstegge" <[log in to unmask]> > Subject: Re: Homeplate apertures, how to use them > MIME-Version: 1.0 > Content-Type: multipart/alternative; > boundary="----=_NextPart_000_0068_01C184E5.B6848580" > > I agree, but for subcontracting that's a situation that I > can only dream of. The reality is that you get Gerber data (one to one > with the pads) that you need to edit yourself, or you need to make clear > instructions for the company that makes the stencils so they can do the > Gerber-editing. > > Daan Terstegge > > > > ----- Original Message ----- > > From: Jeff Seeger <mailto:[log in to unmask]> > To: [log in to unmask] <mailto:[log in to unmask]> > Sent: Friday, December 14, 2001 6:56 PM > Subject: Re: [TN] Homeplate apertures, how to use > them > > > "d. terstegge" wrote: > > > > snip < > > How do others deal with this ? Mabe you have > suggestions on how to make an easier-to-use specification ? Or ideas > about easier ways to order a stencil according to my spec ? > > > > > Wouldn't this be handled best in design? > That way it can > be a part of the footprint and happen "by > itself". > > > Most of the dense boards I've seen lately > are very difficult > to determine which pads relate to each other > with any degree > of certainty. Silkscreens are so > compromised as to not be > reliable indicators. > > > Just a thought, > -- > > > Jeff Seeger Applied > CAD Knowledge Inc > Chief Technical Officer > Tyngsboro, MA 01879 > jseeger "at" appliedcad "dot" com > 978 649 9800 > > > > -------------------------------------------------------------------------- > ------- > Technet Mail List provided as a free service by IPC > using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] > <mailto:[log in to unmask]> with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the > following message: SET Technet NOMAIL > Search previous postings at: www.ipc.org > <http://www.ipc.org> > On-Line Resources & Databases > E-mail Archives > Please visit IPC web site ( > <http://www.ipc.org/html/forum.htm>) for additional > information, or contact Keach Sasamori at > [log in to unmask] <mailto:[log in to unmask]> or 847-509-9700 ext.5315 > > -------------------------------------------------------------------------- > ------- > > > > Date: Fri, 14 Dec 2001 14:46:45 -0600 > From: Earl Moon <[log in to unmask]> > Subject: Re: Homeplate apertures, how to use them > > Some things you can do include editing Gerber (dumb xy data) > or ODB++ > (intellegent) data using a CAM package as Valor. This > package, as an > example, provides clearly identifiable graphic information > concerning pads, > with special features, and their locations. All this is > provided you have > built in design rules as ERF's (external reference files). > > Also, if the stencil maker is using a similar package it may > easily > translate requirements into an AOI system. If so, AOI is an > answer I've used > many times, when applicable. Don't know why this isn't done > more. Asked this > group some time back but no responses. > > MoonMan > Date: Fri, 14 Dec 2001 16:04:03 EST > From: "Stephen R. Gregory" <[log in to unmask]> > Subject: Re: Alumina filled Polysulfide compound... What Did > Charles Say? > MIME-Version: 1.0 > Content-Type: multipart/alternative; > boundary="part1_147.65a01ae.294bc343_boundary" > > Thanks Gary, Genny, and Dave! > > I wonder why I got Charles email all garbled like that? I > get those every once in a while...I was attributing it before to the email > being sent using a foreign language character set, obviously that wasn't > the case if all of you could read it...strange stuff? > > Thanks again, and thank you Charles! > > -Steve Gregory- > > P.S. Charles, I would appreciate it if you would send me the > info you have...next week would be fine, and most appreciated! Also, I > don't think we have the same customer... > > In a message dated 12/14/01 2:19:37 PM Central Standard > Time, [log in to unmask], > [log in to unmask], and [log in to unmask] writes: > > > > > From: "Charles Caswell" < [log in to unmask] > <mailto:[log in to unmask]>> > Subject: Re: [TN] Alumina filled Polysulfide > compound... > Date: Friday, December 14, 2001 11:28 AM > > Steve, I am at home so I don't have the info here . > We use the same stuff to bond components on some boards. I don't think you > will find the stuff already mixed with the AlO2. I couldn't. The > polysulfide IS fuel tank sealant. We mix it in small batches with approx. > equal parts of AlO2 and the base material by weight. I wonder if we have > the same customer. I will try to get into work tommorow and send some > info, if not then on Mon. By the way, the stuff stinks. > Charles Caswell > > > > > Hi, > > I will be back on 12/17/01. > > Regards, > Jong > > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------