Date: Fri, 7 Dec 2001
13:37:39 -0600
Subject: TechNet Digest - 7 Dec 2001 - Special issue
(#2001-764)
There are 12 messages totalling 921 lines in this issue.
Topics in this special issue:
1. Info on lead free reflow profiles sought (3)
2. Alkaline Etchant--response
3. Via repairs (2)
4. SURFACE FINISHES (2)
5. 2 Conformal Coating ?'s (2)
6. BGA Visual Inspection (2)
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Date: Fri, 7 Dec 2001 12:31:26 -0500
Subject: Re: Info on lead free reflow profiles sought
MIME-Version: 1.0
Content-Type: text/plain
Hi Eric,
check
processes/reflow. the link that pops-up an article is
"lead-free reflow
soldering ".
Besides that, a couple of days ago I got mail from Vitronics, having
inside
a CD called "5 steps to lead-free". The problem is I don't
know why I got
it, was it me ordering it, probably through their website, or
simply, a
courtesy from Vitronics? Mistery!
I think you could also contact Vitronics for this CD.
Regards,
Ioan
> -----Original Message-----
> Sent: Friday, December 07, 2001 11:36 AM
> Subject: [TN] Info on lead free
reflow profiles sought
>
> After half an hour's fruitless searching of the net I thought
of Technet.
>
> Can anyone out there point me at a web page or email me a
reflow profile
> for one of the higher
> melting point lead free solders. I'm trying to produce a test
spec to
> determine whether some
> temperature sensitive components would survive a 'worst case'
reflow
> cycle.
>
> By the way. I note that many of the lead free alloys contain
Bismuth.
> Isn't this more toxic
> than lead? Am I being naive in my surprise that one toxic
chemical is
> being replaced with
> something equally bad?
>
> Regards,
>
>
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Date: Fri, 7 Dec 2001 12:36:12 -0500
Subject: Re: Info on lead free reflow profiles sought
MIME-Version: 1.0
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Eric,
I am still hunting for good net sites for your first
request.
With regards to the latter:
No, bismuth is not more toxic. Bismuth oxychloride is used in
the cosmetics
industry and other bismuth salts (I forget which one(s)) are used
in
PeptoBismol® (Did I spell that right?) No bismuth
compounds are listed in
the 1990 "NIOSH Pocket Guide to Chemical Hazards" I have
and only bismuth
telluride is listed in the ACGIH TLV Booklet - because of the
tellurium.
Toxicity does come into play in its mining, though, as 10 to 40%
(depends on
who you talk to and/or whether you are talking world-wide or
country
specific) comes as a by-product of lead mining.
regards,
Bev Christian
Research in Motion
-----Original Message-----
Sent: December 7, 2001 11:36 AM
Subject: [TN] Info on lead free reflow profiles sought
After half an hour's fruitless searching of the net I thought of
Technet.
Can anyone out there point me at a web page or email me a reflow
profile for
one of the higher
melting point lead free solders. I'm trying to produce a test spec
to
determine whether some
temperature sensitive components would survive a 'worst case' reflow
cycle.
By the way. I note that many of the lead free alloys contain
Bismuth. Isn't
this more toxic
than lead? Am I being naive in my surprise that one toxic chemical
is being
replaced with
something equally bad?
Regards,
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Date: Fri, 7 Dec 2001 09:40:07 -0800
Subject: Re: Info on lead free reflow profiles sought
MIME-Version: 1.0
Content-Type: text/plain; charset="us-ascii";
format=flowed
Eric,
I hate to assume anything, so.....in case you are not aware there is
a
LeadFreeNet also with IPC, you may want to post this there
also.
Richard
At 04:35 PM 12/7/01 +0000, you wrote:
After half an hour's fruitless searching of
the net I thought of Technet.
Can anyone out there point me at a web page or email me a reflow
profile
for one of the higher
melting point lead free solders. I'm trying to produce a test spec
to
determine whether some
temperature sensitive components would survive a 'worst case' reflow
cycle.
By the way. I note that many of the lead free alloys contain
Bismuth.
Isn't this more toxic
than lead? Am I being naive in my surprise that one toxic chemical
is
being replaced with
something equally bad?
Regards,
Date: Fri, 7 Dec 2001 12:52:54 EST
Subject: Re: Alkaline Etchant--response
MIME-Version: 1.0
Content-Type: text/plain; charset="US-ASCII"
Content-Transfer-Encoding: 7bit
The following are some tips on running alkaline etchant, especially
where
production volume has decreased.
1. Alkaline etchants are formulated with ammonia and chloride
contents
appropriate for percentage operating time. You may have now
"hitched a race
horse to an ox cart" so to speak. You may want to contact
your vendor to
change to a product more suited to your present operation, just as
when your
volume went up, you traded your ox for the race horse.
Why is that? Race horse etchants are formulated for say 75%
operation time
and frequent sump turnover, - with high chloride (copper
capacity) and lower
excess ammonia (little idle time for ammonia evaporation).
2. As much as possible, group your etching work into
"bursts" of activity.
Close down the dampers and shut off the sump heat when the etcher is
not in
use.
3. Decrease the sump volume as much as possible with glass bricks,
or similar
inert media. This will allow more sump turnovers of the spent
etchant per
week. Calculate the turnover time for your sump - If it is
longer than a
couple of days - you are going to be fighting add-backs of anhydrous
ammonia,
or walking a tightrope with aqua ammonia add-backs.
Rudy misses one point in specificaions on incoming alkaline
etchant.
Essentially all alkaline etchant uses recycle ammonia, and rest
assured the
copper in spent etchant is reclaimed. This ammonia
recycle step means the
spec is wider than for formulated products, but when you need to
brag about
recycle in your shop, point out that BOTH the copper and the ammonia
in your
spent alkaline etch get recycled.
Denny Fritz
MacDermid, Inc.
Date: Fri, 7 Dec 2001 09:48:23 -0800
Subject: Via repairs
MIME-Version: 1.0
Content-Type: text/plain; format=flowed
I am trying to do some repairs on vias of an assembled board that
were
damaged due to test technicians scraping soldermask for ICT.
The vias show
signs of thinning/cracking at the knee. IPC 7721 shows that
using eyelets
are the acceptable repair for plated thru holes but they do not
address vias
anywhere that I am aware of. I can't imagine putting eyelets
into a via.
I am considering putting a solid wire into the via and filling it
with
solder to make the connection from top to bottom. Is this
acceptable? If
not then what is an acceptable method of repair? Any input
would be
appreciated.
Sincerely
Jim
_________________________________________________________________
Date: Fri, 7 Dec 2001 12:05:30 -0600
Subject: Re: SURFACE FINISHES
MIME-Version: 1.0
Content-Type: text/plain; charset="us-ascii"
Hi Charlie! I hadn't seen an assembler's response so I'll deposit
mine for
TechNet dissection. We have qualified immersion gold, immersion tin,
and
immersion silver as alternative pwb surface finishes for our
manufacturing
processes as HASL replacements. I don't foresee any one of the
three
alternatives as becoming "dominate" because each has both
pro's and con's:
Immersion gold: wonderfully flat, good long term solderability,
good
industry availability, BUT black pad issues, its a nasty chemistry
on
soldermask, and soldering to nickel is not soldering to
copper
Immersion tin: wonderfully flat, metallurgical compatibility,
reworkable,
BUT long term solderability issues, compatibility with soldermasks,
and
supply sources
Immersion silver: wonderfully flat, reworkable, great RF
design
characteristics, BUT supply source issues, metallurgical questions,
and
long term solderability questions
I think that the selection of an alternative surface finishes will
become a
question of materials organization within a particular
manufacturing
environment - HASL made our choices simpler but was definitely
robustness
limiting for certain manufacturing flows (like SMT fine
pitch).
Dave Hillman
Rockwell Collins
cc:
Subject: Re: [TN] SURFACE FINISHES
EARL:
Does your view hold the same from an assemblers point of
view.
More specifically, in your history, would the assembler prefer ENIG
over
SILVER and/or TIN?
THe assemblers I speak with just do not have the
background/experience to
decide. However, they
are quick to reject the bare board vendor for what they THINK is
a
solderability problem.
(That's when I move with failure review etc. I hope to reduce
this
incidence
dramatically by proposing user friendly finishes based on board
design.)
Charlie
-----Original Message-----
Sent: Wednesday, December 05, 2001 12:14 PM
Subject: Re: [TN] SURFACE FINISHES
As a cost factor to you it's nickle and dime stuff. To most board
shops I
work with, it is as well. It's a matter of choice so much that it's
almost
subjective (whatever looks best though black pad isn't too pretty)
-
excluding HASL, or course. I hope you are right about its final
demise.
MoonMann
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Date: Fri, 7 Dec 2001 12:08:00 -0600
Subject: Re: Via repairs
MIME-Version: 1.0
Content-Type: multipart/mixed;
boundary="=_CC91EC8C.73127F25"
I have used solid wire for a long time and have had no issues with
this method. I do suggest though to leave a small amount of a tail
to lay over the pad on each side. I feel that this allows the
vertical fill and also gives the joint a little more integrity with the
lead soldered onto the pad also.
Kathy
Date: Fri, 7 Dec 2001 17:51:07 -0000
Subject: Re: 2 Conformal Coating ?'s
MIME-Version: 1.0
Content-Type: text/plain; charset="iso-8859-1"
Graham,
You really must see someone about your delusions over UV cured
coatings,
which are successfully used to coat many thousands of pcb's each
year. I
know someone who has a nice sofa you can stretch out on whilst you
tell him
all about it.... <g>
Suitability for UV has nothing to do with 3D v. 2D, more to do with
the
complexity of the assembly geometry and the application methodology.
These
will determine if a secondary cure mechanism is needed for the
application.
In many instances (and with some of our customers), full cure is
achieved
just with light.
Regards,
Peter
--
--------------------------------------------------------
INTERTRONICS is dedicated to providing quality
material, consumable and equipment solutions to the
electronics manufacturing and other technology based
industries, with the highest levels of technical
support
and customer service.
-----Original Message-----
Sent: 06 December 2001 16:52
Subject: Re: [TN] 2 Conformal Coating ?'s
Mike
You would be better to go with a conventional coating. UV is not
ideal for
3D objects - works great in 2D, cos you don't have to bend light!
:-)
I cannot remember what the operating environment was for your
circuit - if
you would care to repeat, I can recommend something - however, I am
sure
that a one part AR or UR coating from a reliable supplier will give
you the
best overall results - process and operating environment.
Regards, Graham Naisbitt
For instant access to Product Data Sheets register on the Tech-Shot area of
Concoat Limited
Alasan House, Albany Park
CAMBERLEY GU16 7PH UK
Phone: +44 (0)1276 691100
Fax: +44 (0)1276 691227
Mobile: +44 (0)79 6858 2121
-----Original Message-----
Sent: Thursday, December 06, 2001 02:41
Subject: [TN] 2 Conformal Coating ?'s
Hello,
Thanks in advance if you have taken the time to read this!
#1- Im trying different materials in a spray application. Both are cured
using UV. One material does a "secondary cure" w/ moisture. This is cool
because after 100 hours after UV cure, all material is fully cured.
The other material Im trying uses HEAT for a secondary cure, or, if
shodowed during UV cure, the material wont cure and never will. Obviously I
dont want the stuff dripping or running anywhere, but being new to this
wonderful process, just dont feel good about leaving uncured material on a
product for it's entire life. Iv been told that you can "test" the product
to see if the uncured material is causing a problem but Im not sure what
type of test that would consist of. Any insight?
#2- Has anyone out there ever installed refelctive metal plates in their UV
oven to limit shadowing?
Thanks so much,
Mike Manwell
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Date: Fri, 7 Dec 2001 17:51:15 -0000
Subject: Re: 2 Conformal Coating ?'s
MIME-Version: 1.0
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Mike,
Question 1: Whatever cure mechanism you use, be sure not to leave any
uncured material around, as it is likely to cause trouble in the future,
whether it me just messy, or something else. For example, the electrical
characteristics of the uncured coating are likely to be very different than
the cured one.
One point about moisture cure is, of course, that it is moisture dependent,
and as Jon More stated, not in your control - can vary in cure time from
very short to, sometimes, not at all!
Question 2: A good idea if your pcb geometry needs it. Years ago, I saw a
curing machine where the lamp was swung back and forth in an arc over the
conveyor whilst the assembly moved through, to help in this area. Lamps can
also be added on the sides of conveyors, giving extra light perpendicular to
the overhead lamp.
If you can choose a coating which cures with UV *and* visible light, you
might find a better result. The visible light travels farther, reflects and
bounces around into the nooks and crannies much better.
Regards,
Peter
--
--------------------------------------------------------
INTERTRONICS is dedicated to providing quality
material, consumable and equipment solutions to the
electronics manufacturing and other technology based
industries, with the highest levels of technical
support and customer service.
-----Original Message-----
Sent: 06 December 2001 14:41
Subject: [TN] 2 Conformal Coating ?'s
Hello,
Thanks in advance if you have taken the time to read this!
#1- Im trying different materials in a spray application. Both are cured
using UV. One material does a "secondary cure" w/ moisture. This is cool
because after 100 hours after UV cure, all material is fully cured.
The other material Im trying uses HEAT for a secondary cure, or, if
shodowed during UV cure, the material wont cure and never will. Obviously I
dont want the stuff dripping or running anywhere, but being new to this
wonderful process, just dont feel good about leaving uncured material on a
product for it's entire life. Iv been told that you can "test" the product
to see if the uncured material is causing a problem but Im not sure what
type of test that would consist of. Any insight?
#2- Has anyone out there ever installed refelctive metal plates in their UV
oven to limit shadowing?
Thanks so much,
Mike Manwell
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Date: Fri, 7 Dec 2001 13:36:13 -0500
Subject: Re: SURFACE FINISHES
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Hello Mr. Hillman:
Thank you very much for your input. Your time is most appreciated.
As a board supplier I do prefer ENIG when process control is superior
(black pad notwithstanding). However, it is the customer
who is King and our goal is to surpass their requirements for quality
and reliablity. As CM's are now a driving force as to vendor choice,
their needs
have become a primary influencer in choosing friendly surface finishes
beneficial to their process.
What comments might you have relative to solderability problems found
specific to silver/gold/tin coatings.
When the design calls for fine pitch what do you choose for your
facility? And why?
Regarding silver again; would corrosion of the surface upon exposure to
flux be an issue at rework?
Secondly, when reflow issues arise, have you found them to be traced
back to the thickness of the silver itself (or lack of thickness)?
One view is that as lead is taken out of the PCB fab process, one of
these alternative finishes will dominate. The driver will be
rework/touch-up flexibility as to which one wins. Would you agree?
Your insights are thanked for in advance.
Charlie McMahon
McMahon Sales Company
David Hillman wrote:
Hi Charlie! I hadn't seen an assembler's response so I'll deposit mine for
TechNet dissection. We have qualified immersion gold, immersion tin, and
immersion silver as alternative pwb surface finishes for our manufacturing
processes as HASL replacements. I don't foresee any one of the three
alternatives as becoming "dominate" because each has both pro's and con's:
Immersion gold: wonderfully flat, good long term solderability, good
industry availability, BUT black pad issues, its a nasty chemistry on
soldermask, and soldering to nickel is not soldering to copper
Immersion tin: wonderfully flat, metallurgical compatibility, reworkable,
BUT long term solderability issues, compatibility with soldermasks, and
supply sources
Immersion silver: wonderfully flat, reworkable, great RF design
characteristics, BUT supply source issues, metallurgical questions, and
long term solderability questions
I think that the selection of an alternative surface finishes will become a
question of materials organization within a particular manufacturing
environment - HASL made our choices simpler but was definitely robustness
limiting for certain manufacturing flows (like SMT fine pitch).
Dave Hillman
Rockwell Collins
cc:
Subject: Re: [TN] SURFACE FINISHES
EARL:
Does your view hold the same from an assemblers point of view.
More specifically, in your history, would the assembler prefer ENIG over
SILVER and/or TIN?
THe assemblers I speak with just do not have the background/experience to
decide. However, they
are quick to reject the bare board vendor for what they THINK is a
solderability problem.
(That's when I move with failure review etc. I hope to reduce this
incidence
dramatically by proposing user friendly finishes based on board design.)
Charlie
-----Original Message-----
Sent: Wednesday, December 05, 2001 12:14 PM
Subject: Re: [TN] SURFACE FINISHES
As a cost factor to you it's nickle and dime stuff. To most board shops I
work with, it is as well. It's a matter of choice so much that it's almost
subjective (whatever looks best though black pad isn't too pretty) -
excluding HASL, or course. I hope you are right about its final demise.
MoonMann
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Date: Fri, 7 Dec 2001 11:59:39 -0700
Subject: Re: BGA Visual Inspection
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We purchased an ERSAScope recently after evaluating both X-Ray & ERSA. We
are now in the process of getting two more ESRAScopes. All the features have
been beneficial to us.
Rick Howieson
Delta Group Electronics, Inc.
-----Original Message-----
From: Anderson, Greg (IndSys, GEFanuc, NA)
Sent: Friday, December 07, 2001 9:44 AM
Subject: [TN] BGA Visual Inspection
> TechNet Friends,
> We are looking into visual inspection of BGAs to supplement our
> X-Ray inspection. I am somewhat familiar with the ERSASCOPE. It appears
> to be a fully developed, well-thought out system, with all the options to
> make life easy. It appears that their supplemental tools in fact, do add
> value to the endoscope itself. This, of course, comes at a price.
> I'm hoping to hear from people who have personally evaluated such
> tools.
> Are all the features of the ERSA truly benefits?
> Are there other systems that do what the ERSASCOPE does? Are they
> as fully developed as the ERSA?
>
> Thanks for your help with this one,
> I
>
> Greg Anderson
> Senior Advanced Manufacturing Engineer
> GE Fanuc Automation
> Charlottesville, VA 22911
> Phone: 434-978-5181
> FAX: 434-978-5898
>
>
>
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Date: Fri, 7 Dec 2001 14:44:17 -0500
Subject: Re: BGA Visual Inspection
MIME-Version: 1.0
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Hi Greg!
We recently bought an ErsaScope, after checking out the alternatives at Apex last year. There are a couple of companies making similar products, for similar prices. We went with the Ersa system. The Ersa seems more fully developed than the others - purpose built vs adapted. And viewing on the PC gives you some flexibility that the others didn't - just live video monitors typically.
The ErsaScope comes with some well developed software. Will you truly use all it's functions?? It depends, but we don't. The defect / QA library it comes with - we don't use. We use it for inspection, and for documenting things like problem parts.. It's great for taking pictures. We didn't go for the Magniscope option, if I had to do it again I might.
regards
Graham Collins
Process Engineer,
Northrop Grumman
Atlantic Facility of Litton Systems Canada
(902) 873-2000 ext 6215
> TechNet Friends,
> We are looking into visual inspection of BGAs to supplement our
> X-Ray inspection. I am somewhat familiar with the ERSASCOPE. It appears
> to be a fully developed, well-thought out system, with all the options to
> make life easy. It appears that their supplemental tools in fact, do add
> value to the endoscope itself. This, of course, comes at a price.
> I'm hoping to hear from people who have personally evaluated such
> tools.
> Are all the features of the ERSA truly benefits?
> Are there other systems that do what the ERSASCOPE does? Are they
> as fully developed as the ERSA?
>
> Thanks for your help with this one,
> I
>
> Greg Anderson
> Senior Advanced Manufacturing Engineer
> GE Fanuc Automation
> Charlottesville, VA 22911
> Phone: 434-978-5181
> FAX: 434-978-5898
>
>
>
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