I second Paul's suggestion, and back up all the other comments that have been made about the dangers of trying to "normally" mount an electrolytic in this situation. Is your customer just arrogantly stubborn, or does he have a very good reason for needing the componenet mounted hard down? It really isn't possible to do without component damage in the short term, unless you are allowed to put a stand-off/isolator washer between component and PCB that accommodates the stress relief forming of the leads (such isolators are available). The isolator would offer mechanical support to the electrolytic while also providing relief to the leads (unless there is a height constraint). If you are still forced to follow customer instruction to hard-mount, I would issue a written disclaimer that you will not be held responsible for the failure of this component. Good luck. Hope there isn't too big a rock near the hard place. Peter Duncan Lucas Paul-R32425 To: [log in to unmask] <Paul.Lucas@MOT cc: (bcc: DUNCAN Peter/Asst Prin Engr/ST OROLA.COM> Aero/ST Group) Sent by: Subject: Re: [TN] To form or not to Form TechNet <[log in to unmask] G> 12/13/01 07:25 AM Please respond to "TechNet E-Mail Forum." Andre, Is there clearance around the capacitor? If there is, why not lay the part flat on its side with the legs parallel to the board and then form the leads to fit the holes? It will take several bends to align to the hole and another bend to put the leads down into the hole but,the part will be flat against the board and there will be no stress on the leads at the body part. Paul -----Original Message----- From: Andre Leclair [mailto:[log in to unmask]] Sent: Wednesday, December 12, 2001 6:26 AM To: [log in to unmask] Subject: [TN] To form or not to Form Hi all I hope this gets some good advice. I have a customer who is requiring the placement of an electrolitic cap that has a lead spacing of 0.140" and the PCB has 0.100". They do not want the leads formed, they want the part flat to the board. In doing this, am I opening myself up to stress induced failures of the component. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- [This e-mail is confidential and may also be privileged. If you are not the intended recipient, please delete it and notify us immediately; you should not copy or use it for any purpose, nor disclose its contents to any other person. Thank you.] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------