I really echo Warren's message. When first developing HP's BGA rework process, using SRT, it took three months to get everything almost right. Then, there were surprises needing rectification. It never really ended as new boards and components were designed and built plus CPI. The process first must be developed. It must be transferred to manufacturing including all procedures for everyone and all parts involved, or those perceived to be, it must be validated for each part on each board type, and operators must be trained for each shift. Though most all operators great at their jobs, some definitely caught on quicker and did consistently better jobs than others. Profiles alone can take much development time, and they're long themselves, no matter the paste or original assembly profile. Parts must be removed and sites cleaned and touched up and thoroughly inspected. A costly supply of nozzles must be bought as well. Micro stencils must be purchased and processes developed for their use. Part replacement and reflow processes must be right on. X-ray inspection is a must for rework, as it is for prototypes, before final test, and on it goes. This is a good one to "farm out." I think you already knew this or are an excellent rework engineer yourself. MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------