Yes, I was working with the late great Dr. Paul Craven, then at Lamination Technology Inc, when Phil came in and presented his findings, or lack thereof, concerning the condition. IPC says in 3.1.8, Resin Recession: Resin recession in a plated through hole is generally defined as a separation between the plated barrel of the hole and the dielectric material on the hole wall. It is acceptable for all classes after thermal stress testing unless otherwise specified in the procurement documentation. I think the phrase after thermal stress testing tells most of the story. Also, IPC, as with many guidelines and acceptance criteria, emphasizes unless otherwise specified in the procurement documentation. That too tells a story about not necessarily knowing cause but leaving it to the customer to make the decision concerning whether or not it is acceptable of cause for rejection. Earl Moon --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------