Again, the lamination process often is more overlooked than most others. A basic part of any process management tool must be to audit the process. As you say, running the lamination process calibration simply is to, on a regular basis, place the thermocouple "book" into the press openings, using say 5 places, to determine the profile. It's not much different than profiling a wave or reflow soldering process. Much else to do but often overlooked. MoonMan --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------