check this out:

http://www.alphametals.com/products/solderpaste/tech_art.html

Ioan

> -----Original Message-----
> From: Earl Moon [SMTP:[log in to unmask]]
> Sent: Tuesday, December 18, 2001 2:27 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Solder paste evaluation
>
> Provided you have proven solderable component termination areas (end caps,
> leads, etc.), one of the best ways to determine your requirements is to
> reflow on a very clean ceramic substrate. You can pull the devices off the
> substrate easily and examine process, and attendant element, effects.
>
> MoonMan
>
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