check this out: http://www.alphametals.com/products/solderpaste/tech_art.html Ioan > -----Original Message----- > From: Earl Moon [SMTP:[log in to unmask]] > Sent: Tuesday, December 18, 2001 2:27 AM > To: [log in to unmask] > Subject: Re: [TN] Solder paste evaluation > > Provided you have proven solderable component termination areas (end caps, > leads, etc.), one of the best ways to determine your requirements is to > reflow on a very clean ceramic substrate. You can pull the devices off the > substrate easily and examine process, and attendant element, effects. > > MoonMan > > -------------------------------------------------------------------------- > ------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: SET > Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & Databases > > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > -------------------------------------------------------------------------- > ------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------