Hi Jason I'm not qualified to comment on joint reliability on "near neighbors", but can point out that you need to follow rules for moisture sensitive parts if any are nearby. If the heat effect is reflowing the leads then you are risking moisture related damage (e.g. popcorning) if the board hasn't been baked and/or dry stored. regards Graham Collins Process Engineer, Northrop Grumman Atlantic Facility of Litton Systems Canada (902) 873-2000 ext 6215 >>> [log in to unmask] 11/05/01 10:24AM >>> Hello, I am hoping someone here can help with the following: recent inquiries have come up with respect to the effect of BGA rework to surrounding components. Can the heat effect to surrounding components -- the possibility (and probability) that they will reach reflow temperatures, cause problems? I am thinking of cases where some BGA balls might reach reflow temperatures and others might not on a single package at proximity to the reworked site. Another case would be where BGA packages at proximity to the reworked BGA are simply reaching high temperatures - for possibly many heat/rework cycles.. Impact to solder joint metallurgy Impact to solder joint reliability Any help or reference would be greatly appreciated. -- Jason Cross Physical Technology Engineer Alcatel Canada, Inc. (613) 784-4793 --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------