Used to purchase fusing oil with a Chevron label. They had a water soluble as well as solvent oil but seems to me that the WS was at a significantly higher price.  Hollis used to carry oil for their oil injection wave machines which was basically the same thing.  Think it was Hollis 225.  Did a very nice job of wave soldering and reducing dross on the pot but sure was messy.

Mel Parrish
Soldering Technology International
Madison, AL
256 705 5530
256 705 5538 Fax
[log in to unmask]
 


 
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Brooks,Bill
Sent: Monday, November 19, 2001 8:48 AM
To: [log in to unmask]
Subject: Re: [TN] AW: [TN] BGA voids

We used to make PCB's back in the mid 1970's and used a fusing oil produced by Shell Oil in our Hydro-squeegee. I want to say it was some sort of Peanut oil... but I can't remember for sure... Those were my High School years... :)
Good luck... - Bill Brooks
-----Original Message-----
From: David Fish [mailto:[log in to unmask]]
Sent: Monday, November 19, 2001 11:27 AM
To: [log in to unmask]
Subject: Re: [TN] AW: [TN] BGA voids

Who are suppliers of inspection quality oils [Canadian Balson??] the bear the heat of soldering well?
----- Original Message -----
From: [log in to unmask] href="mailto:[log in to unmask]">Bob Willis
To: [log in to unmask] href="mailto:[log in to unmask]">[log in to unmask]
Sent: Monday, November 19, 2001 4:45 AM
Subject: Re: [TN] AW: [TN] BGA voids

The outgassin test for blowhole in printed boards was developed in the years gone bye after it appeared in and Italian PCB specification I was asked to review. After some testing I did it ended up in the IEC specification.
 
The same oil can be used effectivly for outgassing tests with via in pad. In the last test I did with ten scrap boards dfrom different suppliers 2 outgassed on the pads from the vias.
 
The procedure for through hole which could and has been applied to vias is on my web site which is in the download section.
 
Hope this helps.
 
 
Bob Willis
Electronic Presentation Services
2 Fourth Ave, Chelmsford, Essex, CM1 4HA England
 
See us at APEX 2002  www.bobwillis.co.uk/workshops/apex/apex.htm
 
www.bobwillis.co.uk
Tel: (44) 01245 351502 Fax: (44) 01245 496123
 
Single solution to your seminar, conference or roadshow www.seminar-registrations.com
----- Original Message -----
From: [log in to unmask] href="mailto:[log in to unmask]">Busko, Wolfgang
To: [log in to unmask] href="mailto:[log in to unmask]">[log in to unmask]
Sent: Monday, November 19, 2001 9:45 AM
Subject: [TN] AW: [TN] BGA voids

Hi Bob,

so it was you with this ol $B!- (J oil trick I recently cited ond not Earl the
Moonman, sorry for not remembering and citing correct.
Although I often remember the good things my memory for names seems a bit
weak.

Hope you don $B!- (Jt forgive me

Wolfgang

 -----Ursprungliche Nachricht-----
Von: Bob Willis [mailto:[log in to unmask]]
Gesendet am: Freitag, 16. November 2001 18:59
An: [log in to unmask]
Betreff: Re: [TN] BGA voids


We have experienced voiding with via in pad, I know it ws stated that the
pads don't have vias in them but if they did they can somtimes gass through
the plating, its not the air traped by the paste. I have investigated this
with my old outgassing oil test which showes up the problem and will
contribute to voiding.

Bob Willis

See us at APEX 2002  www.bobwillis.co.uk/workshops/apex/apex.htm
<http://www.bobwillis.co.uk/workshops/apex/apex.htm>

www.bobwillis.co.uk <http://www.bobwillis.co.uk>
Tel: (44) 01245 351502 Fax: (44) 01245 496123

Single solution to your seminar, conference or roadshow
www.seminar-registrations.com <http://www.seminar-registrations.com>

----- Original Message -----
From: Peter George  <mailto:Peter George [log in to unmask]>
[log in to unmask]
To: [log in to unmask] <mailto:[log in to unmask]>
Sent: Friday, November 16, 2001 8:52 AM
Subject: Re: [TN] BGA voids

Hi, Peter,

I was at a seminar earlier this year where BGA's and their solder joints
were discussed at some length. The received wisdom is that voids in solder
joints are not of themselves a 'defect' unless they break out through the
side of the ball. In fact, they make the joint more "flexible" - better
able to withstand creep fatigue - so are beneficial, up to a point.

What causes them is often outgassing of volatiles in the solder paste flux
during the reflow process, though the size and shape of voids increases and
changes when there are via-in-pad features as well. About the only way to
detect them is by X-ray, and to judge from previous TechNet postings, there
are some pretty fancy machines around now that can give you a very much
clearer view of the balls than is normally the case ... if you have cash to
splash!

Peter Duncan




                    Peter Lee
                    <ppwlee@YAHOO        To:     [log in to unmask]
<mailto:[log in to unmask]>
                    .COM>                cc:     (bcc: DUNCAN Peter/Asst
Prin Engr/ST
                    Sent by:             Aero/ST Group)
                    TechNet              Subject:     [TN] BGA voids
                    <[log in to unmask]
                    ORG>


                    11/16/01
                    04:25 PM
                    Please
                    respond to
                    "TechNet
                    E-Mail
                    Forum."






Hello,





I am encountering voids after reflow on several micro BGAs on one PCA
product. The voids that I $B!G (Bve observed (with Xray) contribute to as
high as
60-70% of the joint area. My reflow profile was designed by running a
sample board with dummy components and thermalcouples attached right at the
joint. I also inspected the PCB lands and didn $B!G (Bt see any via on pad.





Does anyone know the possible reasons for voids formation in BGA (micro)
reflow?





In general, in step by step how would one trouble shoot such a defect?





Rgds,


Peter






















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