Hello,
I am encountering voids after reflow
on several micro BGAs on one PCA product. The voids
that I’ve observed (with Xray) contribute to as
high as 60-70% of the joint area. My reflow profile
was designed by running a sample board with dummy components and thermalcouples attached right at the joint. I also inspected
the PCB lands and didn’t see any via on pad.
Does anyone know the possible reasons for voids formation in
BGA (micro) reflow?
In general, in step by step how would one trouble shoot such
a defect?
Rgds,
Peter