Just looking into the IPC-SM-782 for landpatterns: The value of "G", which is the distance between the two pads, is 0.6 mm for 0603's but alos for 0805 components. So if you're using IPC-dimensioned footprints, the 0603 should be just as easy to glue as 0805's (or the other way around). On real boards I see quite a lot of variation in the pad-to-pad distance, and the optimization of this value is one of the keys to succesfull glue dispensing for 0603 parts. From what I see, most designers don't care whether a board will be waved of double-reflowed, and they're using the same pads for both technologies. So if I advise a designer to have the pads close together to prevent from tombstoning during reflow, I'll have a problem later on if I have to wave-solder these same components because there's not enough space for a consistent glue dot. Daan Terstegge SMT Centre Thales Communications Unclassified mail Personal Website: http://www.smtinfo.net >>> Jim Gleason <[log in to unmask]> 11/14 8:01 pm >>> RE: [TN] 0603 Components.Most of the 603 packages I've worked with went through the wave of if you had proper thermal profiles. But some people do prefer to reflow them and then cover them with a masking solder palllet. If your interested in the pallet give me a buzz offline. Jim GSC 972-494-1911 ----- Original Message ----- From: Lush, Dorothy (FPTI) To: [log in to unmask] Sent: Wednesday, November 14, 2001 8:35 AM Subject: Re: [TN] 0603 Components. Why are you glueing? Can't you use a selective solderwave? Isn't exposing 0603's to molten solder going to affect their life span? How about using a single dot? Dorothy Lush -----Original Message----- From: Stephen Owen [mailto:[log in to unmask]] Sent: Wednesday, November 14, 2001 5:36 AM To: [log in to unmask] Subject: [TN] 0603 Components. We are having some problems with 0603 components on adhesive, we are running Fugi CP6's. Using 0.3mm dual nozzles, don't seem to be able to get the consistency of the adhesive dot right. Many thanks Steve. --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------