This will help fill your grid ... copper 0.093 cal/gm C (.389 J/gm C) lead 0.031 cal/gm C(.13 J/gm C). Substance||c in J/gm K||c in cal/gm K or Btu/lb F||Molar C J/mol K Aluminum||0.900||0.215||24.3 Bismuth||0.123||0.0294||25.7 Copper||0.386||0.0923||24.5 Brass||0.380||0.092||... Gold||0.126||0.0301||25.6 Lead||0.128||0.0305||26.4 Silver||0.233||0.0558||24.9 Tungsten||0.134||0.0321||24.8 Zinc||0.387||0.0925||25.2 Mercury||0.140||0.033||28.3 Alcohol(ethyl)||2.4||0.58||111 Water||4.186||1.00||75.2 Ice (-10 C)||2.05||0.49||36.9 Granite||.790||0.19||... Glass||.84||0.20||... Material||Thermal conductivity [Wm-1K-1] Al2O3||30 SiC||270 AlN||320 Si||150 Graphite c-axis||6 Graphite a-axis||2000 Mo||130 W||150 Material||Heat capacity [J/g-K] Aluminum||0.8940 Copper||0.3850 Diamond||0.5180 Gold||0.1284 Molybdenum||0.2502 Tungsten||0.1322 Kovar||0.4320 5Sn/95Pb||0.1340 Al2O3||0.7790 Aluminum nitride||0.7450 Mullite/Cordierite ceramic composite||0.6900 Silicon||0.7120 Silica, SiO2||0.7440 Silicon carbide||0.6700 DuPont Kevlar 49||1.450 Polytetrafluoroethylene [PTFE]||1.0283 Gallium arsenide||0.3220 Water||4.1830 Material||Heat capacity [J/kg-°C] Epoxy, phenolic||1694-2093 Material||Thermal conductivity [W/m-°C] 42Ni58Fe||12 29Ni17Co54Fe||40 Material||Thermal conductivity [W/m-°C] E-glass||1.0 [both axial & transverse] S-glass||3.0 [both axial & transverse] Quartz||1.0 [both axial & transverse] Kelvar||0.25 axial Kelvar||0.025 transverse e-PTFE||0.31 axial Material||Thermal conductivity [W/m°C] Epoxy||0.19 Polyimide||0.18 Cyanate ester||0.20 PTFE||0.19 BT||0.20 Material||Thermal conductivity [W/m°C] E-glass/epoxy||0.35 E-glass/polyimide||0.35 E-glass/PTFE||0.26 Quartz/PTFE||0.13 Kelvar 49/Quartrex||0.16 Kelvar 49/polyimide||0.12 Material||Thermal conductivity [W/m°C] Copper [rolled, annealed]||392 Copper [electrodeposited]||392 Material||Thermal conductivity [W/m°C] Urethane||0.07-0.31 Acrylic||0.12-0.25 Epoxy||0.17-0.21 Silicone||0.15-0.31 DAP||0.17-0.21 Material||Thermal conductivity [W/m°C] Parylene-N||0.12 Parylene-C||0.082 Dave Fish ----- Original Message ----- From: "Werner Engelmaier" <[log in to unmask]> To: <[log in to unmask]> Sent: Thursday, November 01, 2001 8:19 AM Subject: [TN] Thermal Capacity > Hi, > I would appreciate any info I could get on the Specific Heat/Thermal Capacity > [J/g.C]/Thermal Mass [J/mm3.C] of the following materials: > FR-4 (glass-epoxy); Polyimide (glass-epoxy); Polyimide (resin only); Mold > Compound; Ceramic; Silicone; Alloy 42; Solder; Copper. > Thanks, > > Werner Engelmaier > > -------------------------------------------------------------------------- ------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > -------------------------------------------------------------------------- ------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------