Hello, I have asked this question before but did not receive many replies. Does anyone have any success or suggestion on measuring P&P machine parameters in line? Such as vacuum pressures, vision alignment error and placement compensation, placement pressure, drive speed and movement. Obviously I am setup SPC for my P&P process. P&P machines that we have in our company do not seem to be "opened" systems. The only parameters I can measure are indirect - pickup error%, reject rate, and I went as far as using test vehicles to verify placement accuracy with AOI. These are however, not direct machine parameters and do not give me a clear picture of the major moving parts on the machine. What other variations within a chip shooting process can one measure and control? Rgds, Peter _________________________________________________________ Do You Yahoo!? Get your free @yahoo.com address at http://mail.yahoo.com --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------