Hi all! I'm a ignorant process guy, I just build stuff. Don't have the "wizard" knowledge about RF stuff. I gotta question though... Why do RF components HAVE to have vias beneath the footprint of the devices? This creates a problem with certain conductive adhesives that are used to bond the PCA's to the chassis, from what I'm seeing, trying to adhere to solder that has flowed out from initial reflow, or during rework when trying to change a suspected failed component after the bloody thing has been bonded to the chassis. Solder flows out and wets to the gold planes and de-bonds the adhesive that's been used to provide ground to the chassis. Why the 'friggen vias? Can't they be placed just outside the component footprint where the solder if it goes to the bottomside won't interfere with whatever black-magic the the RF stuff needs? Conductive adhesives don't seem to like solder that is liquidous, which will naturally flow and spread during rework of a suspected failed part...if you lose ground, you lose god...I've at least learned that, don't quite still understand it, but ground is god in RF talk... Those of you that haven't had to deal with this, consider yourselves lucky... -Steve Gregory- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------