Hi All,
I need to get some information on various components to do a proper analysis
for actual solder reflow profiling needs.
I am interested in components with the largest variation in thermal masses,
e.g., 0603 CC, 1803 CC, 44 I/O PQFP, 100 I/O PBGA, 400 I/O PBGA, 400 I/O
SBGA, 100 I/O CBGA, 400 I/O CBGA, etc.
What I am looking for are the dimensions, volume, weight, and for the
component packages how much of the volume/weight is ceramic, metal(s),
silicon, plastic, exposed heat transfer areas, thermal mass, etc.
Given the large differences in thermal mass, and the higher reflow
temperatures necessary for lead-free solders, the temperature differences at
the reflow peaks are likely to become very important.
Of course, if any of you have done studies in this direction, I would like to
get a copy of these if at all possible.
Thanks,
Werner Engelmaier

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