Hi All, I need to get some information on various components to do a proper analysis for actual solder reflow profiling needs. I am interested in components with the largest variation in thermal masses, e.g., 0603 CC, 1803 CC, 44 I/O PQFP, 100 I/O PBGA, 400 I/O PBGA, 400 I/O SBGA, 100 I/O CBGA, 400 I/O CBGA, etc. What I am looking for are the dimensions, volume, weight, and for the component packages how much of the volume/weight is ceramic, metal(s), silicon, plastic, exposed heat transfer areas, thermal mass, etc. Given the large differences in thermal mass, and the higher reflow temperatures necessary for lead-free solders, the temperature differences at the reflow peaks are likely to become very important. Of course, if any of you have done studies in this direction, I would like to get a copy of these if at all possible. Thanks, Werner Engelmaier --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------