Hi Russ, I used to run about 1.3-1.5N and about 165g/l Cu with an ORP of 550-580 or so. It would seem to me that the parameters you listed would lead to a very fast but somewhat less precise etchant. You may experience undercut and/or poor conductor edge quality. And you're right about potential equipment problems, particularly titanium shafts, nuts, bolts, etc. But it would be fast......... If you're working with 1/4 ounce copper you may want to stand back a few feet to catch the layers as they fly off..... Check with Mr. Sedlak..... he is The Man for cupric questions. Mark At 10:14 AM 11/28/01 -0800, you wrote: >----Thanks to everyone for the info , I was a weak on Cupric, (I spent >my life using mostly Ammonium and Ferric, amongst other more exotic >etches) > >Any way one more simple or not so simple question : > > Would you run a Cupric etcher @ 140g/l Cu and 5N HCl .? > > Is It a correct assumption that somewhat lower N, and higher >copper would , provide faster etch rate. It just seems to me that >operating at an extreme N will basically just cost money in the form of >excess HCL usage , not to mention the wear and tear on the equipment, >and operators., > > >Again thanks for the information! > >Russell Smith > > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------