Hi there. I sent this out once before, but it might have bounced. Is there any guideline or procedure detailing how to handle single surface mount parts, especially fine pitch. I've found several on moisture and ESD, but none on re-packaging. Our production numbers are rather low, so it is not always best to issue the whole tray of parts to the board shop. We need a document to teach the stockroom personnel how to pick up and package individual parts without bending the leads. Thanks for your help. Earl Wildes Sr. Component Engineer Korry Electronics Co. 901 Dexter Ave N. Seattle, WA 98109 206-694-1398 [log in to unmask] --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------