I am not sure why an empty message just got posted. Anyway, here is my question: We are looking to standardize our board finish for all of our through-hole boards. We have many types of finishes (mat or flat,gloss, semi-gloss, dark green, light green)and are looking to change to the mat finish to cover, um hide, the little bit of flux residue that we find exceptable. We use a no-clean flux. Is there any difference in solderability when using different finishes. Do the profiles change between board finishes? Does the type of finish affect defect rate? What are other's using and finding best results? Thanks --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------