Folks, Especially with JK's help during my GaAs FA adventure, a few weeks ago, I was able to determine many interesting factors concerning the use of MIL-STD-883E's test method 2030. It provides details about using C-SAM (scanning acoustic microscopy), to visually determine voiding, and gives graphic acceptance criteria, in percent voiding in, primairly, eutectic and adhesive bonding of semiconductor devices to whatever substrate required. This method, and its criteria, is derived, I presume, from data correlating voiding percentages to thermal conductivity efficiency and effectiveness. However, it does present some drawbacks. As I am preparing to use the same method, or something better if available, do study the effects of various thermal adhesives used to mount RF amplifiers, and various other device types, to a cold wall. The experiments must show the relationship of such voiding in selected adhesives to thermal conductivity. The experiments are straighforward enough. However, the problem is: it is really hard some times, using C-SAM, as an example, to really "see" and quantify the voiding percentage amounts. I need assistance in using a better test method (didn't do well with x-ray on previous occassions), if available, to better "see" and correlate findings. All help appreciated. Earl Moon Also, I meant to say smooth side facing in toward preg on the issue of capacitance planes. Thanks --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------