When I read IPC Standards regarding conformal coating requirements for the
different classes, all I can find is coating thickness on a board.

I'm trying to work to class 3 standards for conformal coating and am
meeting those thickness requirements, however, I have to wonder how it
works on a BGA for example, where the coating thickness is sufficient but
doesn't completely cover and encapsulate the component. In other words,
there is a gap between the top of the BGA and the PCB.

Any thoughts on this would be appreciated.

Thanks,

Mike Manwell

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