Palladium solderability problems
Kevin
In general Palladium solution rate is much slower than other sacrificial finish materials we use for the purpose.  The key then is to extend the duration of the reflow zone to accommodate the slower rate and it should improve the wetting results. 

Mel Parrish
Soldering Technology International
102 Tribble Drive
Madison, AL 35758
256 705 5530
256 705 5538 Fax
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Kevin Stokes
Sent: Thursday, October 04, 2001 1:43 PM
To: [log in to unmask]
Subject: [TN] Palladium solderability problems

Everyone,

We are recently having some issues with a G sensor getting adequate solderability to the palladium leads.

We have looked at the reflow profiles and temps and times look good.

Any ideas what I should look at next to get a grip on this problem?

As always, your help is appreciated.

Kevin

Kevin Stokes
Reliability Manager
Kimball Electronics Group
(812) 634-4207