I would like to know also more about the technique, especially if it should be applied for circuits with specific finishes or for all.
Gaby
----------
From: Earl Moon[SMTP:[log in to unmask]]
Reply To: TechNet E-Mail Forum.
Sent: יום רביעי 24 אוקטובר 2001 13:21
Subject: Re: [TN] Antw: [TN] exposing intermetallic on BGA pads...
Guenter,
I cannot believe how much I am learning every minute about soldering and all
comprising it. Not at all being negative or contrary, I must have ruined
thousands of solder joints in my long life in this business notwithstanding
all the rework I've done and taught others.
All I've ever been taught, done, and taught others is to remove the solder,
with whatever means that works without damaging pads or board materials,
then print paste, place components, and reflow.
I've never even heard of leaving on solder or removing intermetallics -
especially with a glass brush. I finished my last contract, seemingly
successfully, two months ago. Can the world and all its "wonderful"
soldering technology all of a sudden be passing me by in such a short time?
Jeez, a glass brush. Thanks again Guenter, but I must need more help than
even you, Bob Willis, or all other experts can give.
Earl
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