An interesting thought, but the failures have happened on control boards which typically do not need thermal relief because these caps aren't connected to a plane. I'd be interested to understand how orientation of the cap could cause a failure as it passes through the wave. I'm still trying to figure out the connection to failures on only a given few boards when all 0.062" thick boards are run under the same wave solder parameters and I'd guess that 99.9% or our boards use at least 1 if not more of these Roederstein caps. Definitely a conundrum. -----Original Message----- From: Kathy Kuhlow [mailto:[log in to unmask]] Sent: Thursday, October 11, 2001 2:32 PM To: [log in to unmask] Subject: Re: [TN] failing capacitors Are the capacitor locations properly thermal relieved? What is the orientation into the wave at this location? Could it be that the part is being thermally shocked due to lack of stress relief in the PCB or orientation into the wave? Kathy --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------