Palladium solderability problemsKevin In general Palladium solution rate is much slower than other sacrificial finish materials we use for the purpose. The key then is to extend the duration of the reflow zone to accommodate the slower rate and it should improve the wetting results. Mel Parrish Soldering Technology International 102 Tribble Drive Madison, AL 35758 256 705 5530 256 705 5538 Fax [log in to unmask] -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Kevin Stokes Sent: Thursday, October 04, 2001 1:43 PM To: [log in to unmask] Subject: [TN] Palladium solderability problems Everyone, We are recently having some issues with a G sensor getting adequate solderability to the palladium leads. We have looked at the reflow profiles and temps and times look good. Any ideas what I should look at next to get a grip on this problem? As always, your help is appreciated. Kevin Kevin Stokes Reliability Manager Kimball Electronics Group (812) 634-4207