Palladium solderability problemsKevin
In general Palladium solution rate is much slower than other sacrificial
finish materials we use for the purpose.  The key then is to extend the
duration of the reflow zone to accommodate the slower rate and it should
improve the wetting results.
Mel Parrish
Soldering Technology International
102 Tribble Drive
Madison, AL 35758
256 705 5530
256 705 5538 Fax
[log in to unmask]



  -----Original Message-----
  From: TechNet [mailto:[log in to unmask]]On Behalf Of Kevin Stokes
  Sent: Thursday, October 04, 2001 1:43 PM
  To: [log in to unmask]
  Subject: [TN] Palladium solderability problems


  Everyone,

  We are recently having some issues with a G sensor getting adequate
solderability to the palladium leads.

  We have looked at the reflow profiles and temps and times look good.

  Any ideas what I should look at next to get a grip on this problem?

  As always, your help is appreciated.

  Kevin

  Kevin Stokes
  Reliability Manager
  Kimball Electronics Group
  (812) 634-4207