My past recalls that for that test copper elongation was much more important than copper plate thickness.  I think you want to be greater than 12% elongation when you plate, then one mil to one ounce is probably enough.

Chuck Brummer
Acuson

Wayne Martin wrote:

Need some help!We are trying to pass the IPC TM-650 2.4.36 Rework simulation test. We are having ICD in trying to pass the test. We pass the solder float test.We run a direct plate (palladium) line. We have platted anywhere from 1 mil. of copper in the through holes all the way to 2.5 mil. of copper in the holes and still fail the test.Looking for any help that anyone can give me.Wayne MartinElectronic Service and Design