I'm seeing this the same way as Kathy Kuhlow. But, if this board has heavy internal layers and is preheated enough to get good top side solder fillets, the solder may still be molten when it comes out of the end of the machine. Are we looking at disturbed joints here? Guy Ramsey Senior Lab Technician / Instructor E-Mail: [log in to unmask] <mailto:[log in to unmask]> Ph: (610) 362-1200 x107 Fax: (610) 362-1290 -----Original Message----- From: TechNet [mailto:[log in to unmask]]On Behalf Of Kathy Bergman Sent: Friday, August 10, 2001 2:00 PM To: [log in to unmask] Subject: [TN] Solder conditions I am looking to get some help in identifying the causes of certain post wave solder conditions. In particular, a "cracked ice" effect in which the very surface of the solder looks like a thin layer of it has been cracked in the way that ice would crack. Another one is lumpy solder, as if the solder had dirt in it. (I know it doesn't). I am a board manufacturer with just a minimum of assembly knowledge. I am unable to post a good picture of the conditions at this time. I am wondering if there are some on line resources I can tap into, to see some visual examples of these and other conditions. Also, what would be a normal wave profile for a board such as this: .093 thick FR4, through hole technology, approx. 6x11, .025 to .195 sized holes, HASL finish. Please include any prebake information. I apprectiate in advance any help I can get. Kathy Bergman ---------------------------------------------------------------------------- ----- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------- ----- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 --------------------------------------------------------------------------------- --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------