I not sure I understand what you're saying about your customer's requirement, but appreciate your concern about printing too much paste and floating the part. We assemble with EPTSSOP [Exposed Pad Thin Shrink Small Outline Package] parts, which sounds similar to your part. EPTSSOP increases the thermal efficiency of power constrained standard TSSOP packages by as much as 150% by soldering the heat sink pad on the bottom of the package to the board. Apparently, Amkor [the part fabricator] is particularly optimistic about our ability to assemble boards with these parts. So, they provide virtually no information on their site, other than "use standard processes". [er, words to that effect] We printed various paste volumes, placed, reflowed, and sectioned dummy parts from Practical Components [probably Top Line and others have similar parts]. If your customer is asking you to prove that there is solder coverage of the gold pad for the heat sink after soldering, * Why not just pop the part off the board with a beer can opener? * Never tried this, but wont your xray machine show this? Dave Fish ----- Original Message ----- From: "Andre Leclair" <[log in to unmask]> To: <[log in to unmask]> Sent: Tuesday, October 23, 2001 11:39 AM Subject: [TN] SMT part with Backside Ground > Hi All > > Hope some one can help? We have have a board from a customer which has a > PSSop-16 with a Backside Ground ( #RF2119DBP). The stencil house has made > a cutout that is slightly smaller then the ground on the device. The > ground plane area on the card is basically the size of the body of the part > with 10 via holes in it. > The customer wants evidance of solder reflow on the ends (Tinning of the > Gold Plate). Current stencil does not get enough paste to do this and we > are concerned that if we make the cut out larger then the device contact, > the part may ride on top of the extra solder and result in > opens/insufficients on the leads. Also I have been unable to find a > recomended land/paste pattern for this type of device. > Any ideas would be appreciated. > > -------------------------------------------------------------------------- ------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8d > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL > Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > -------------------------------------------------------------------------- ------- > --------------------------------------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8d To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ---------------------------------------------------------------------------------